Stimulator system with electrode array and the method of making the same
First Claim
Patent Images
1. An implantable microstimulator, comprising:
- a microstimulator housing comprising an exterior surface with a metal region, the housing defining an exterior and an interior;
a plurality of thin, flat, conductive electrodes each having an exposed broad active surface that is disposed over the metal region of the exterior surface of the housing;
non-conductive adhesive sandwiched between, and in direct contact with, the metal region and each of the plurality of conductive electrodes, the non-conductive adhesive attaching each of the plurality of conductive electrodes to a portion of the metal region with the non-conductive adhesive disposed on top of the exterior surface of the housing and beneath the exposed surface of each of the plurality of conductive electrodes;
an electronic subassembly disposed in the interior of the housing;
at least one conductive via extending from the interior of the housing to a location that is exterior to the housing, the at least one conductive via electrically coupled to the electronic subassembly; and
at least one exterior conductor that is disposed entirely external to the housing, the at least one exterior conductor electrically coupling the conductive via to the plurality of conductive electrodes, wherein at least a portion of the at least one exterior conductor is disposed external to the adhesive;
wherein the plurality of conductive electrodes are configured and arranged to stimulate tissue adjacent to the plurality of conductive electrodes on the housing of the microstimulator when implanted.
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Accused Products
Abstract
An implantable microstimulator can include a housing with a surface containing a metal region. The housing defines an exterior and an interior. At least one conductive electrode is disposed on the exterior of the housing over the metal region of the housing. Adhesive is disposed between the metal region of the housing and the conductive electrodes. An electronic subassembly is disposed in the interior of the housing and coupled to the conductive electrodes through the housing.
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Citations
20 Claims
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1. An implantable microstimulator, comprising:
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a microstimulator housing comprising an exterior surface with a metal region, the housing defining an exterior and an interior; a plurality of thin, flat, conductive electrodes each having an exposed broad active surface that is disposed over the metal region of the exterior surface of the housing; non-conductive adhesive sandwiched between, and in direct contact with, the metal region and each of the plurality of conductive electrodes, the non-conductive adhesive attaching each of the plurality of conductive electrodes to a portion of the metal region with the non-conductive adhesive disposed on top of the exterior surface of the housing and beneath the exposed surface of each of the plurality of conductive electrodes; an electronic subassembly disposed in the interior of the housing; at least one conductive via extending from the interior of the housing to a location that is exterior to the housing, the at least one conductive via electrically coupled to the electronic subassembly; and at least one exterior conductor that is disposed entirely external to the housing, the at least one exterior conductor electrically coupling the conductive via to the plurality of conductive electrodes, wherein at least a portion of the at least one exterior conductor is disposed external to the adhesive; wherein the plurality of conductive electrodes are configured and arranged to stimulate tissue adjacent to the plurality of conductive electrodes on the housing of the microstimulator when implanted. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of making an implantable microstimulator, the method comprising:
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disposing an electronic subassembly in a microstimulator housing, the housing comprising an exterior surface with a metal region and defining an exterior and an interior; attaching a pluralilty of thin, flat, conductive electrodes each having an exposed broad active surface over the metal region of the exterior surface of the housing using a non-conductive adhesive sandwiched between, and in direct contact with, the metal region and each of the plurality of conductive electrodes, wherein the non-conductive adhesive is disposed on top of the exterior surface of the housing and beneath the exposed surface of each of the plurality of conductive electrodes; electrically coupling the electronic subassembly to at least one conductive via, wherein the conductive via extends from the interior of the housing to a location that is exterior to the housing; and electrically coupling the at least one conductive via to the plurality of conductive electrodes using at least one exterior conductor that is disposed entirely external to the housing, the at least one exterior conductor electrically coupling the conductive via to the plurality of conductive electrodes, wherein at least a portion of the at least one exterior conductor is disposed external to the adhesive; wherein the plurality of conductive electrodes are configured and arranged to stimulate tissue adjacent to the plurality of conductive electrodes on the housing of the microstimulator when implanted. - View Dependent Claims (15, 16, 17, 18)
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19. A method of using an implantable microstimulator, comprising:
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implanting an implantable microstimulator comprising a microstimulator housing having an exterior surface with a metal region, the housing defining an exterior and an interior;
a plurality of thin, flat, conductive electrodes each having an exposed broad active surface that is disposed over the metal region of the exterior surface of the housing;
non-conductive adhesive sandwiched between, and in direct contact with, the metal region and each of the plurality of conductive electrodes, the non-conductive adhesive attaching each of the plurality of conductive electrodes to a portion of the metal region with the non-conductive adhesive disposed on top of the exterior surface of the housing and beneath the exposed surface of each of the plurality of conductive electrodes;
an electronic subassembly disposed in the interior of the housing;
at least one conductive via extending from the interior of the housing to a location that is exterior to the housing, the at least one conductive via electrically coupled to the electronic subassembly; and
at least one exterior conductor that is disposed entirely external to the housing, the at least one exterior conductor electrically coupling the conductive via to the plurality of conductive electrodes, wherein at least a portion of the at least one exterior conductor is disposed external to the adhesive; andproviding an electrical signal to the plurality of conductive electrodes to stimulate a tissue adjacent to the plurality of conductive electrodes on the housing of the microstimulator. - View Dependent Claims (20)
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Specification