High-temperature sensor interface and network
First Claim
1. A sensor interface comprisingat least one sensor connector for connecting a sensor having an analog signal;
- a microprocessor fabricated using a silicon-on-insulator (SOI) process capable of operating at temperatures greater than at least 275°
C. and at clock speeds of more than about 8 MHz for modifying the analog signal; and
a communication device for transmitting a modified and digitally converted signal to a receiving device.
2 Assignments
0 Petitions
Accused Products
Abstract
The present invention is a sensor interface or network of interfaces that utilizes high-temperature electronics to operate at elevated temperatures for applications that include but are not limited to aircraft and automobile engines, vehicle frames, refineries, nuclear and chemical production plants, and in downhole drilling for petroleum and natural gas. The interface or network provide connectors for a variety of sensors with analog and digital outputs, and can in turn provide data to an automated electronic control system or a monitor. Because the sensor interface may be placed in so-called “hot zones” nearer to the sensors being monitored than other systems that use conventional electronics, the sensor interface can increase noise immunity, increase reliability, decrease cost, reduce weight, and increase space.
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Citations
22 Claims
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1. A sensor interface comprising
at least one sensor connector for connecting a sensor having an analog signal; -
a microprocessor fabricated using a silicon-on-insulator (SOI) process capable of operating at temperatures greater than at least 275°
C. and at clock speeds of more than about 8 MHz for modifying the analog signal; anda communication device for transmitting a modified and digitally converted signal to a receiving device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A sensor interface comprising
at least one sensor connector for connecting a sensor having an analog signal; -
a microprocessor fabricated using a silicon-on-insulator (SOI) process capable of operating at temperatures greater than at least 135°
C. and at clock speeds of more than about 125 MHz for modifying the analog signal; anda communication device for transmitting a modified and digitally converted signal to a receiving device. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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19. A sensor interface comprising
at least one sensor connector for connecting a sensor having an analog signal; -
a microprocessor fabricated using a silicon-on-insulator (SOI) process capable of operating at temperatures greater than at least 135°
C. and at clock speeds of more than about 8 MHz for modifying the analog signal;a communication device for transmitting a modified and digitally converted signal to a receiving device; and an enclosure that encloses at least the microprocessor and the communication device, wherein the enclosure, microprocessor and communication device are capable of reliable operation at vibrations of 60 g'"'"'s at a frequency of 4,000 Hz. - View Dependent Claims (20, 21, 22)
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Specification