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Photonic milling using dynamic beam arrays

  • US 8,178,818 B2
  • Filed: 09/22/2008
  • Issued: 05/15/2012
  • Est. Priority Date: 03/31/2008
  • Status: Expired due to Fees
First Claim
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1. A laser processing system comprising:

  • a beam positioning system to align beam delivery coordinates relative to a workpiece, the beam positioning system generating position data corresponding to the alignment;

    a pulsed laser source;

    a beamlet generation module to receive a laser pulse from the pulsed laser source, and to generate from the laser pulse a beamlet array comprising a plurality of beamlet pulses;

    a beamlet modulator to modulate the amplitude of each beamlet pulse in the beamlet array; and

    beamlet delivery optics to focus the modulated beamlet array onto one or more targets at locations on the workpiece corresponding to the position data;

    wherein the beamlet generation module comprises a discretely banded reflectivity plate comprising;

    a first surface comprising a first plurality of respectively reflective bands; and

    a second surface comprising a second plurality of respectively reflective bands;

    wherein the first surface is configured to;

    receive the laser pulse into the discretely banded reflectivity plate; and

    successively reflect diminishing portions of the laser pulse received from the second surface back into the discretely banded reflectivity plate toward the second surface; and

    wherein the second surface is configured to;

    successively transmit a first part and reflect a second part of the diminishing portions of the laser pulse received from the first surface, the transmitted first part corresponding to respective beamlet pulses in the beamlet array.

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