High power LED module assembly and method for manufacturing the same

• US 8,179,037 B2
• Filed: 12/31/2009
• Issued: 05/15/2012
• Est. Priority Date: 01/06/2009
• Status: Expired due to Fees

• Current Assignee: OSRAM GmbH (Ams-Osram AG)
• Original Assignee: OSRAM Licht AG (Ams-Osram AG)
• Inventors: Chan, Chi Man, He, Xi Yuan, Yue, Chin You, Ye, Ze Sheng
• Primary Examiner(s): Won, Bumsuk
• Application Number:
  US12/650,575
• Publication Number:
  US 20100171405A1
• Time in Patent Office: 866 Days
• Field of Search: 313/506, 313/512, 257/79, 257/98, 257/99, 257/100, 257/433, 257/434, 362/294, 362/249.01, 362/249.02
• US Class Current: 313/506
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21S 2/00 Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
• CPC Class Codes: F21S 4/26 of rope form, e.g. LED lighting ropes, or of tubular form
• CPC Class Codes: F21V 15/013 the housing being an extrusion
• CPC Class Codes: F21V 17/104 using feather joints, e.g. tongues and grooves, with or without friction
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21V 3/062 the material being plastics
• CPC Class Codes: F21V 31/00 Gas-tight or water-tight arrangements
• CPC Class Codes: F21V 31/005 Sealing arrangements therefor
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A high power LED module assembly may include at least one high power LED module each of which includes a MCPCB and a high power LED disposed on the MCPCB, a flex tube which includes a base engaging with each of the high power LED modules and a cover enclosing the base; wherein the high power LED module assembly further comprises at least one heat sink each of which is correspondingly connected to the bottom of each high power LED modules; and wherein the cover is engaged with the heat sink and encloses the base, the high power LED module and all other sides of the heat sink than the bottom side thereof which is exposed to ambient environment.

Claims

1. A high power LED module assembly, comprising:

at least one high power LED module each of which includes a MCPCB and a high power LED disposed on the MCPCB,

a base engaging with each of the high power LED modules and

a flex tube including;

a cover enclosing the base, the cover including;

a diffuser portion having an annular cross section;

two side portions integrally extending downward from the diffuser portion;

at least one heat sink each of which is correspondingly connected to a side of each of said high power LED modules; and

wherein the cover hermetically encloses the high power LED modules, at least one side of said heat sink being environmentally exposed outside of said hermetic enclosure.

2. The high power LED module assembly as claimed in claim 1, wherein the cover comprises a tubular portion and two side portions integrally extending downward from the tubular portion, each of the two side portions of the cover being formed with at least one lug at its inside which projects inwardly;

and wherein the heat sink is correspondingly formed on each of its outer sides with at least one groove which mates with the lug in shape, the at least one lug cooperating with the at least one groove so as to achieve engagement of the cover and the heat sink.

3. The high power LED module assembly as claimed in claim 2, wherein the sectional shape of the lug is similar to the shape of a table tennis bat positioned horizontally.

4. The high power LED module assembly as claimed in claim 1, wherein the base has two side portions substantially extending in vertical direction and a middle portion extending horizontally, such that the sectional shape of the base is similar to the shape of a letter “

I”

.

5. The high power LED module assembly as claimed in claim 4, wherein one of the two side portions of the base is provided with a bus circuit which functions to electrically connect the high power LED module.

6. The high power LED module assembly as claimed in claim 4, wherein the base is formed with at least one hole at its middle portion, and the high power LED module and the heat sink are in direct contact with each other through the at least one hole.

7. The high power LED module assembly as claimed in claim 1, wherein at least one of the base and the cover are made of PVC.

8. The high power LED module assembly as claimed in claim 1, wherein the heat sink is made of aluminum.

9. The high power LED module assembly as claimed in claim 1, wherein the heat sink has a plurality of cooling fins.

10. The high power LED module assembly as claimed in claim 1, wherein the high power LED module, the heat sink and the base are connected with each other via screws.

11. A method for manufacturing a high power LED module assembly, the method comprising:

manufacturing a base by extrusion process and punching at least one holes in the base;

manufacturing a cover formed by extrusion process with a diffuser portion having an annular cross section and two side portions integrally extending downward from the diffuser,

inserting at least one high power LED module each of which includes a MCPCB and a high power LED and at least one heat sink into the holes upwardly and downwardly respectively and fixing them together via screws; and

enclosing the base as well as the high power LED module and the heat sink fixed therewith with the cover formed by-extrusion process such that, except the bottom of the heat sink exposed to ambient environment, the base, the high power LED module and other portions of the heat sink are enclosed by and hermetically engaged with the cover.

12. A method for manufacturing a high power LED module assembly, the high power LED module assembly comprising:

at least one high power LED module each of which includes a MCPCB and a high power LED disposed on the MCPCB, a base engaging with each of the high power LED modules and a flex tube which includes a cover enclosing the base, the cover including a diffuser portion having an annular cross section and two side portions integrally extending downward from the diffuser;

wherein the high power LED module assembly further comprises at least one heat sink each of which is correspondingly connected to the bottom of each high power LED modules; and

wherein the cover hermetically encloses the high power LED modules, at least one side of the heat sink being environmentally exposed outside of said hermetic enclosure, the method comprising;

manufacturing a base by extrusion process and punching at least one holes in the base;

inserting at least one high power LED module each of which includes a MCPCB and a high power LED and at least one heat sink into the holes upwardly and downwardly respectively and fixing them together via screws; and

enclosing the base as well as the high power LED module and the heat sink fixed therewith a cover formed by extrusion process such that, except the bottom of the heat sink exposed to ambient environment, the base, the high power LED module and other portions of the heat sink are enclosed by and hermetically engaged with the cover.