Magnetic resonance compatible multichannel stripline balun

• US 8,179,137 B2
• Filed: 03/31/2009
• Issued: 05/15/2012
• Est. Priority Date: 03/31/2009
• Status: Active Grant

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Feng, Limin, Laurich, Gene, Zemskov, Aleksey, Juhasz, Kolman, Spence, Dan Kenrick
• Primary Examiner(s): Koval, Melissa
• Assistant Examiner(s): FETZNER, TIFFANY A
• Application Number:
  US12/416,014
• Publication Number:
  US 20100244977A1
• Time in Patent Office: 1,141 Days
• Field of Search: 324300-322, 324/328, 600407-435, 333/25, 333/26, 333219-235, 336/200, 336/229, 382128-131
• US Class Current: 324/322
• CPC Class Codes: H01P 5/10 for coupling balanced lines or devices with unbalanced lines or devices
• CPC Class Codes: H03H 5/003 comprising distributed impedance elements together with lumped impedance elements

Abstract

Systems and devices for transmitting radio frequency signals to and from radio frequency coils in magnetic resonance imaging systems are provided. In one embodiment, a balun for blocking induced radio frequency current on ground conductors of a multi-layer signal carrier includes first and second insulative elements disposed on first and second sides of the signal carrier, respectively, a conductive layer partially surrounding ends of each insulative element with a central region of each insulative element not surrounded by the respective conductive layer, first and second capacitive circuits coupled to the conductive layers of each respective insulative element in the central region thereof, vias extending through the signal carrier, and conductive material disposed in the vias electrically coupling a conductive layer on respective ends of the first and second elements with one another and with the ground conductors.

Claims

1. A balun capable of operating in a magnetic resonance imaging system, the balun configured to block induced radio frequency current on ground conductors of a stripline multi-layer signal carrier without requiring conversion into or out of a coaxial cable, the multi-layer signal carrier including alternating signal conductors and the ground conductors, the balun comprising:

first and second insulative elements disposed on first and second sides of the multi-layer signal carrier, respectively;

a conductive layer partially coating an exterior of each insulative element, wherein the conductive layer does not coat a central region of each insulative element substantially transverse to a direction of the multi-layer signal carrier, such that each insulative element comprises a first conductively coated region and a second conductively coated region separated from one another by the central region that is not conductively coated, wherein the central region is substantially equidistant to an entrance of the multi-layer signal carrier into the balun and an exit of the multi-layer signal carrier out of the balun;

first and second capacitive circuits respectively coupling the first and second conductively coated regions of each respective insulative element across the central regions thereof;

vias extending through the multi-layer signal carrier; and

conductive material disposed in the vias electrically coupling the first conductively coated regions of the insulative elements with the ground conductors around the entrance of the multi-layer signal carrier into the balun and the second conductively coated regions of the insulative elements with the ground conductors around the exit of the multi-layer signal carrier out of the balun.

2. The balun of claim 1, wherein the multi-layer signal carrier includes two signal conductors and three ground conductors, the signal conductors being disposed between pairs of the ground conductors.

3. The balun of claim 1, wherein the capacitive circuits tune the balun to the Larmor frequency.

4. The balun of claim 1, comprising conductive pads disposed on the first and second sides of the multi-layer signal carrier, and wherein the conductive layers are electrically coupled to the conductive pads.

5. The balun of claim 1, comprising a conductive shield spaced from and at least partially surrounding the conductive layers.

6. The balun of claim 5, wherein the shield is electrically contiguous around the first and second sides of the multi-layer signal carrier.

7. The balun of claim 6, wherein the multi-layer signal carrier includes additional vias and conductive material disposed in the additional vias for electrically coupling a first shield element on the first side of the multi-layer signal carrier with a second shield element on the second side of the multi-layer signal carrier.

8. A balun capable of operating in a magnetic resonance imaging system, the balun configured to block induced radio frequency current on ground conductors of a stripline multi-layer signal carrier without requiring conversion into or out of a coaxial cable, the multi-layer signal carrier including alternating signal conductors and the ground conductors, the balun comprising:

capacitive circuits disposed on first and second sides of the multi-layer signal carrier;

at least four conductors, a first and second of the conductors disposed on the first side of the multi-layer signal carrier and coupled to one another via at least one of the capacitive circuits, and a third and fourth of the conductors disposed on the second side of the multi-layer signal carrier and coupled to one another via at least one other of the capacitive circuits, wherein the first and third of the conductors are generally disposed near an entrance of the multi-layer signal carrier to the balun and the second and fourth of the conductors is generally disposed near an exit of the multi-layer signal carrier from the balun;

vias extending through the multi-layer signal carrier; and

conductive material disposed in the vias electrically coupling the first and second conductors on the first side of the signal carrier respectively to the third and fourth conductors on the second side of the multi-layer signal carrier and to the ground conductors to establish a capacitive/inductive network.

9. The balun of claim 8, wherein the conductors disposed on the first side of the multi-layer signal carrier have the same dimensions as the conductors disposed on the second side of the multi-layer signal carrier.

10. The balun of claim 8, wherein the first and second conductors have substantially equal dimensions to one another, such that the first conductor is a mirror image of the second conductor.

11. The balun of claim 8, wherein the first and second conductors have unequal dimensions relative to one another.

12. The balun of claim 8, wherein the conductors comprise conductive layers covering a portion of five respective faces of each of four nonconductive rectangular blocks.

13. The balun of claim 12, wherein the four nonconductive rectangular blocks comprise a nonconductive plastic.

14. The balun of claim 8, comprising a conductive shield surrounding the conductors and electrically separated from the conductors, the conductive shield being configured to block inductance to the conductors from an external source.

15. A magnetic resonance system comprising:

a radio frequency coil configured to receive radio frequency emissions from a subject and to generate signals based upon the received emissions;

a signal processing circuit for receiving the signals;

an interface circuit disposed between the radio frequency coil and the signal processing circuit, the interface circuit comprising a stripline multi-layer signal carrier portion having alternating embedded signal conductors and ground conductors; and

a balun configured to block induced radio frequency current flowing on the ground conductors in the multi-layer signal carrier portion without requiring conversion into or out of a coaxial cable, the balun including capacitive circuits disposed on first and second sides of the multi-layer signal carrier portion, at least four conductors disposed on first and second sides of the multi-layer signal carrier portion, two conductors on each side being coupled to opposite sides of the capacitive circuits such that the multi-layer signal carrier passes beneath or above a first of the two conductors before passing beneath or above a second of the two conductors, vias extending through the multi-layer signal carrier portion, and conductive material disposed in the vias electrically coupling the two conductors on the first side of the multi-layer signal carrier portion to the two respective conductors on the second side of the multi-layer signal carrier portion and to the ground conductors to establish a capacitive/inductive network.

16. The system of claim 15, wherein the interface circuit includes a plurality of feeding circuits disposed along the signal carrier portion.

17. The system of claim 16, comprising a plurality of similar baluns disposed along the multi-layer signal carrier portion intermediate the feeding circuits.

18. The system of claim 16, wherein the feeding circuits and the multi-layer signal carrier portion are provided on a single multi-layer circuit board, portions of which form the signal carrier portion.

19. The system of claim 16, wherein the radio frequency coil comprises a plurality of antennas configured to receive a respective plurality of signals from the plurality of feeding circuits.

20. The system of claim 15, wherein the multi-layer signal carrier portion is configured to carry radio frequency signals.