Low cost integrated antenna assembly and methods for fabrication thereof

• US 8,179,323 B2
• Filed: 12/18/2008
• Issued: 05/15/2012
• Est. Priority Date: 03/17/2008
• Status: Expired due to Fees

• Current Assignee: Kyocera AVX Components San Diego Inc (Kyocera Corporation)
• Original Assignee: Ethertronics, Inc. (Kyocera Corporation)
• Inventors: Shamblin, Jeffrey, Desclos, Laurent, Krier, Mark
• Primary Examiner(s): Owens, Douglas W
• Assistant Examiner(s): Tran, Chuc
• Application Number:
  US12/337,639
• Publication Number:
  US 20090231206A1
• Time in Patent Office: 1,244 Days
• Field of Search: 343/700.MS, 343/824, 343/829, 343/846, 343/853, 343/893, 343/702, 343/895, 235/462.45
• US Class Current: 343/700.MS
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

A conductive layer is applied to a thermoformed plastic component to form an integrated antenna assembly. The conductive layer is on a flexible layer and adhered or attached to the rigid thermoformed plastic carrier. Features are designed into the thermoformed plastic carrier to provide electrical contacts from the conductive layer to the circuit board of the communication device and to mechanically attach the carrier to the circuit board. Multiple conductive layers can be applied to a multi-layered thermoformed structure to form a multi-antenna assembly.

Claims

1. A method for fabrication of an integrated antenna assembly, comprising;

thermoforming a plastic carrier element to yield a three-dimensional configuration adapted to fit within a communication wireless device, said plastic carrier element having a top surface and a bottom surface thereof,

providing a first dielectric thin-sheet material, and a first conductive material;

applying the first conductive material to the first dielectric thin-sheet material to form a first conductive layer;

providing a second dielectric thin-sheet material, and a second conductive material;

applying said second conductive material to said second dielectric thin-sheet material to form a second conductive layer; and

attaching said first and second conductive layers to at least one of said top surface or said bottom surface of said plastic carrier element.

2. The method of claim 1, wherein said first conductive material and said second conductive material are independently selected from the group consisting of:

a conductive ink, a conductive sheet, a conductive film, and a deposited metal.

3. The method of claim 1, wherein said applying comprises at least one of a printing, depositing, or placing of said conductive material on at least one surface of said first and second dielectric thin-sheet materials.

4. The method of claim 1, wherein at least one of said dielectric thin-sheet materials comprises a thickness between about 0.0001 inches and about 0.020 inches.

5. The method of claim 1, wherein at least one of said dielectric thin-sheet materials comprises a T_m between about 50.0°

C. and about 300.0°

C.

6. The method of claim 1, wherein said attaching comprises at least one of, gluing, affixing, adhering, bonding, or mechanically combining said first and second conductive layers to said plastic carrier element.

7. The method of claim 1, wherein multiple antenna elements are individually stacked between two or more dielectric layers to form a multi-antenna assembly.

8. The method of claim 1, comprising:

thermoforming a plurality of plastic carriers in an array, and;

applying a separate conductive layer to each of said plastic carriers of said array.

9. The method of claim 8, wherein said plurality of plastic carriers are attached to said conductive layers using a tape and reel apparatus.

10. An integrated antenna assembly for use in a wireless communication device, comprising:

a thermoformed plastic carrier comprising at least one anchoring element for anchoring said plastic carrier to a PCB board;

a first conductive element applied to a first dielectric thin-sheet material to form a first conductive layer;

a second conductive element applied to a second dielectric thin-sheet material to form a second conductive layer; and

said first and second conductive layers each being attached to the plastic carrier on at least one surface thereof;

wherein said antenna comprises a plurality of conductive elements being individually disposed between two or more dielectric layers.

11. The antenna assembly of claim 10, wherein said thermoformed plastic carrier comprises a T_m between about 50.0°

C. and about 300.0°

C.

12. The antenna assembly of claim 11, wherein said first and second conductive layers are each attached to said plastic carrier by at least one of:

a glue, adhesive, solvent bond, melt bond, or friction fitting.

13. The antenna assembly of claim 10, wherein said anchoring element is attached to said PCB board by at least one of a contact clip, contact spring, screw, or a heat stacking pin.

14. The antenna assembly of claim 13, wherein said anchoring element is a contact slot, wherein said contact slot is adapted to engage said contact clip.

15. The antenna assembly of claim 13, wherein said anchoring element is a contact groove, wherein said contact groove is adapted to engage said contact spring.

16. The antenna assembly of claim 13, wherein said anchoring element is an integrated bump, wherein said integrated bump is adapted to engage said heat stacking pin.