×

Low cost integrated antenna assembly and methods for fabrication thereof

  • US 8,179,323 B2
  • Filed: 12/18/2008
  • Issued: 05/15/2012
  • Est. Priority Date: 03/17/2008
  • Status: Expired due to Fees
First Claim
Patent Images

1. A method for fabrication of an integrated antenna assembly, comprising;

  • thermoforming a plastic carrier element to yield a three-dimensional configuration adapted to fit within a communication wireless device, said plastic carrier element having a top surface and a bottom surface thereof,providing a first dielectric thin-sheet material, and a first conductive material;

    applying the first conductive material to the first dielectric thin-sheet material to form a first conductive layer;

    providing a second dielectric thin-sheet material, and a second conductive material;

    applying said second conductive material to said second dielectric thin-sheet material to form a second conductive layer; and

    attaching said first and second conductive layers to at least one of said top surface or said bottom surface of said plastic carrier element.

View all claims
  • 7 Assignments
Timeline View
Assignment View
    ×
    ×