Method for manufacturing display device including laser irradiation and selective removing of a light absorber layer
First Claim
1. A method for manufacturing a display device, comprising the steps of:
- forming a light-absorbing layer over an insulating surface;
forming an insulating layer over the light-absorbing layer;
selectively irradiating the light-absorbing layer and the insulating layer with laser light to remove an irradiated region of the insulating layer and form a first opening in the insulating layer so that a portion of the light-absorbing layer is exposed;
selectively removing the portion of the light-absorbing layer by using the insulating layer having the first opening as a mask and forming a second opening in the insulating layer and the light-absorbing layer so that a portion of the insulating surface is exposed; and
forming a conductive layer in the second opening, the conductive layer being in contact with the light-absorbing layer,wherein the light-absorbing layer comprises a conductive material.
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Accused Products
Abstract
A display device which can be manufactured with improved material use efficiency and through a simplified manufacturing process, and a manufacturing technique thereof. A light-absorbing layer is formed, an insulating layer is formed over the light-absorbing layer, the light-absorbing layer and the insulating layer are selectively irradiated with laser light to remove an irradiated region of the insulating layer so that a first opening is formed in the insulating layer, and the light-absorbing layer is selectively removed by using the insulating layer having the first opening as a mask so that a second opening is formed in the insulating layer and the light-absorbing layer. A conductive film is formed in the second opening to be in contact with the light-absorbing layer, thereby electrically connecting to the light-absorbing layer with the insulating layer interposed therebetween.
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Citations
35 Claims
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1. A method for manufacturing a display device, comprising the steps of:
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forming a light-absorbing layer over an insulating surface; forming an insulating layer over the light-absorbing layer; selectively irradiating the light-absorbing layer and the insulating layer with laser light to remove an irradiated region of the insulating layer and form a first opening in the insulating layer so that a portion of the light-absorbing layer is exposed; selectively removing the portion of the light-absorbing layer by using the insulating layer having the first opening as a mask and forming a second opening in the insulating layer and the light-absorbing layer so that a portion of the insulating surface is exposed; and forming a conductive layer in the second opening, the conductive layer being in contact with the light-absorbing layer, wherein the light-absorbing layer comprises a conductive material. - View Dependent Claims (4, 6, 8, 30)
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2. A method for manufacturing a display device, comprising the steps of:
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forming a first conductive layer over an insulating surface; forming a light-absorbing layer over the first conductive layer; forming an insulating layer over the light-absorbing layer; selectively irradiating the light-absorbing layer and the insulating layer with laser light to remove an irradiated region of the light-absorbing layer and an irradiated region of the insulating layer and form a first opening in the light-absorbing layer and the insulating layer so that a portion of the first conductive layer is exposed; selectively removing the portion of the first conductive layer by using the light-absorbing layer and the insulating layer having the first opening as a mask and forming a second opening in the insulating layer, the light-absorbing layer, and the first conductive layer so that a portion of the insulating surface is exposed; and forming a second conductive layer in the second opening, the second conductive layer being in contact with the light-absorbing layer, the second conductive layer, wherein the light-absorbing layer comprises a conductive material. - View Dependent Claims (3, 5, 7, 9, 31)
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10. A method for manufacturing a display device, comprising the steps of:
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forming a first conductive layer over an insulating surface; forming a light-absorbing layer over the first conductive layer; forming an insulating layer over the light-absorbing layer; selectively irradiating the light-absorbing layer and the insulating layer with laser light to remove an irradiated region of the light-absorbing layer and an irradiated region of the insulating layer and form a first opening in the light-absorbing layer and the insulating layer so that a portion of the first conductive layer is exposed; selectively removing the portion of the first conductive layer by using the light-absorbing layer and the insulating layer having the first opening as a mask and forming a second opening in the insulating layer, the light-absorbing layer, and the first conductive layer so that a portion of the insulating surface is exposed; and forming a second conductive layer in the second opening, the second conductive layer being in contact with the light-absorbing layer and the second conductive layer, wherein the light-absorbing layer comprises a metal. - View Dependent Claims (11, 12, 13, 14, 32)
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15. A method for manufacturing a display device, comprising the steps of:
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forming a first conductive layer over an insulating surface; forming a light-absorbing layer over the first conductive layer; forming an insulating layer over the light-absorbing layer; selectively irradiating the light-absorbing layer and the insulating layer with laser light to remove an irradiated region of the light-absorbing layer and an irradiated region of the insulating layer and form a first opening in the light-absorbing layer and the insulating layer so that a portion of the first conductive layer is exposed; selectively removing the portion of the first conductive layer by using the light-absorbing layer and the insulating layer having the first opening as a mask and forming a second opening in the insulating layer, the light-absorbing layer, and the first conductive layer so that a portion of the insulating surface is exposed; and forming a second conductive layer in the second opening, the second conductive layer being in contact with the light-absorbing layer and the second conductive layer, wherein the first conductive layer comprises a first metal, and wherein the light-absorbing layer comprises a second metal having a melting point lower than a melting point of the first metal. - View Dependent Claims (16, 17, 18, 19, 33)
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20. A method for manufacturing a semiconductor device, comprising the steps of:
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forming a first metal layer over an insulating surface; forming a second metal layer over the first metal layer, the first metal layer having a higher melting point than the first metal layer; forming an insulating layer over the second metal layer; directing laser light to a selected portion of the insulating layer to remove at least the selected portion of the insulating layer and a portion of the second metal layer below the selected portion of the insulating layer, thereby, forming a first opening through the insulating layer and the second metal layer so that a portion of the first metal layer is exposed; selectively removing the portion of the first metal layer by supplying an etching material into the first opening, thereby, forming a second opening in at least the first metal layer so that a portion of the insulating surface is exposed; and forming a conductive layer over the insulating layer so that the conductive layer contacts the first metal layer in the second opening. - View Dependent Claims (21, 22, 23, 24, 25, 34)
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26. A method for manufacturing a semiconductor device, comprising the steps of:
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forming a wiring over an insulating surface; forming an insulating layer on the wiring; irradiating a selected region of the wiring through the insulating layer so that a portion of the insulating layer over the selected region of the wiring is removed, thereby, forming a first opening through the insulating layer so that a portion of the wiring is exposed; selectively removing the portion of the wiring by supplying an etching material into the first opening, thereby, forming a second opening at least in the wiring so that a portion of the insulating surface is exposed; and forming a conductive layer over the insulating layer so that the conductive layer contacts the wiring in the second opening. - View Dependent Claims (27, 28, 29, 35)
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Specification