Method of fabricating semiconductor substrate and method of fabricating light emitting device

• US 8,183,075 B2
• Filed: 07/21/2011
• Issued: 05/22/2012
• Est. Priority Date: 08/26/2009
• Status: Expired due to Fees

• Current Assignee: Seoul Viosys Co., Ltd. (Seoul Semiconductor Co., Ltd.)
• Original Assignee: Seoul Optodevice Company Limited (Seoul Semiconductor Co., Ltd.)
• Inventors: Kim, Chang Youn, Sakai, Shiro, Kim, Hwa Mok, Lee, Joon Hee, Moon, Soo Young, Kim, Kyoung Wan
• Primary Examiner(s): Le, Thao P.
• Application Number:
  US13/137,124
• Publication Number:
  US 20120021546A1
• Time in Patent Office: 306 Days
• Field of Search: 438/46, 438/68, 438/33, 438/460
• US Class Current: 438/46
• CPC Class Codes: H01L 21/0242 Crystalline insulating materials
• CPC Class Codes: H01L 21/02458 Nitrides
• CPC Class Codes: H01L 21/02488 Insulating materials
• CPC Class Codes: H01L 21/02491 Conductive materials
• CPC Class Codes: H01L 21/02502 consisting of two layers
• CPC Class Codes: H01L 21/0254 Nitrides
• CPC Class Codes: H01L 21/02639 Preparation of substrate for selective deposition
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/007 comprising nitride compounds
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate

Abstract

The present invention provides a method of fabricating a semiconductor substrate and a method of fabricating a light emitting device. The method includes forming a first semiconductor layer on a substrate, forming a metallic material layer on the first semiconductor layer, forming a second semiconductor layer on the first semiconductor layer and the metallic material layer, wherein a void is formed in a first portion of the first semiconductor layer under the metallic material layer during formation of the second semiconductor layer, and separating the substrate from the second semiconductor layer by etching at least a second portion of the first semiconductor layer using a chemical solution.

Claims

1. A method of fabricating a light emitting device, the method comprising:

forming a first semiconductor layer on a first substrate;

forming a second semiconductor layer on the first semiconductor layer, wherein a plurality of voids are formed in the first semiconductor layer during formation of the second semiconductor layer; and

forming a plurality of compound semiconductor layers on the second semiconductor layer, wherein the compound semiconductor layers comprise an active layer.

2. The method of claim 1, further comprising:

forming a metallic material layer on the first semiconductor layer before forming the second semiconductor layer,

wherein the voids are formed under the metallic material layer.

3. The method of claim 1, wherein the voids extend to the first substrate during formation of the second semiconductor layer.

4. The method of claim 1, further comprising:

disposing a second substrate on the compound semiconductor layers.

5. The method of claim 4, wherein the voids extend to the first substrate before disposing the second substrate.

6. The method of claim 4, further comprising:

separating the first substrate from the second semiconductor layer after disposing the second substrate.

7. The method of claim 5, wherein separating the first substrate comprises etching a portion of the first semiconductor layer using a chemical solution.

8. The method of claim 1, wherein the first semiconductor layer comprises a GaN-based layer.

9. The method of claim 8, wherein the second semiconductor layer comprises a GaN-based layer.

10. The method of claim 1, wherein the active layer is disposed between a first compound semiconductor layer and a second compound semiconductor layer of the plurality of compound semiconductor layers.

11. The method of claim 7, wherein the chemical solution is introduced to an interface between the first substrate and the first semiconductor layer via the voids.

12. The method of claim 6, wherein separating the first substrate from the second semiconductor layer comprises twisting the first substrate away from the first semiconductor layer.

13. The method of claim 6, wherein separating the first substrate from the second semiconductor layer comprises heating the first substrate, wherein the voids weaken a coupling force between the first substrate and the first semiconductor layer.

14. The method of claim 13, wherein the first substrate is heated to a temperature of 900 to 1100°

C.

15. The method of claim 14, wherein a silicon-based substrate is attached to the first substrate before removing the first substrate.

16. A method of fabricating a light emitting device, the method comprising:

forming a first semiconductor layer on a first substrate;

forming a second semiconductor layer on the first semiconductor layer, wherein a plurality of voids are formed in the first semiconductor layer during formation of the second semiconductor layer;

forming a plurality of compound semiconductor layers on the second semiconductor layer, wherein the compound semiconductor layers comprise an active layer;

forming a metallic material layer on the first semiconductor layer before forming the second semiconductor layer, wherein the voids are formed under the metallic material layer; and

separating the first substrate from the second semiconductor layer after forming the second substrate.

17. The method of claim 16, wherein the first semiconductor layer and the second semiconductor layer comprises GaN, and the metallic material layer comprises Ta.

18. The method of claim 17, wherein the metallic material layer is about 5-100 nm thick.