Reduced defectivity in contacts of a semiconductor device comprising replacement gate electrode structures by using an intermediate cap layer
First Claim
Patent Images
1. A method, comprising:
- forming a dielectric cap layer above a gate electrode structure to fill at least one void in an interlayer dielectric material of a transistor formed above a semiconductor region, said gate electrode structure being laterally embedded in the interlayer dielectric material and comprising a high-k dielectric material and an electrode metal;
forming a contact opening laterally offset from said gate electrode structure so as to extend through said dielectric cap layer and said interlayer dielectric material;
forming a contact material in said contact opening;
removing an excess portion of said contact material so as to expose said dielectric cap layer; and
performing a removal process to remove a first portion of the dielectric cap layer so as to expose said electrode metal of said gate electrode structure and leave a second portion of the dielectric cap layer in said at least one void.
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Abstract
Superior contact elements may be formed in semiconductor devices in which sophisticated replacement gate approaches may be applied. To this end, a dielectric cap layer is provided prior to patterning the interlayer dielectric material so that any previously created cracks may be reliably sealed prior to the deposition of the contact material, while the removal of any excess portion thereof may be performed without an undue interaction with the electrode metal of the gate electrode structures. Consequently, a significantly reduced defect rate may be achieved.
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Citations
20 Claims
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1. A method, comprising:
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forming a dielectric cap layer above a gate electrode structure to fill at least one void in an interlayer dielectric material of a transistor formed above a semiconductor region, said gate electrode structure being laterally embedded in the interlayer dielectric material and comprising a high-k dielectric material and an electrode metal; forming a contact opening laterally offset from said gate electrode structure so as to extend through said dielectric cap layer and said interlayer dielectric material; forming a contact material in said contact opening; removing an excess portion of said contact material so as to expose said dielectric cap layer; and performing a removal process to remove a first portion of the dielectric cap layer so as to expose said electrode metal of said gate electrode structure and leave a second portion of the dielectric cap layer in said at least one void. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method, comprising:
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forming an electrode metal in an opening of a gate electrode structure of a transistor, said gate electrode structure being laterally embedded in a dielectric material; removing an excess portion of said electrode metal by performing a first removal process; forming a dielectric cap layer above said electrode metal and said dielectric material to fill at least one void in said dielectric material; forming a contact opening in said dielectric cap layer and said dielectric material without exposing said electrode metal, said contact opening connecting to one of a drain region and a source region; forming a contact metal in said contact opening and above said dielectric cap layer; removing an excess portion of said contact metal by performing a second removal process; and exposing said electrode metal by removing a first portion of the dielectric cap layer, wherein a second portion of the dielectric cap layer remains in said at least one void. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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18. A method, comprising:
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forming a dielectric cap layer above a gate electrode structure to fill at least one void in an interlayer dielectric material of a transistor formed above a semiconductor region, said gate electrode structure being laterally embedded in the interlayer dielectric material and comprising a high-k dielectric material and an electrode metal; and performing a removal process to remove a first portion of the dielectric cap layer so as to expose said electrode metal of said gate electrode structure and leave a second portion of the dielectric cap layer in said at least one void. - View Dependent Claims (19, 20)
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Specification