Plating film, printed wiring board, and module substrate

• US 8,183,463 B2
• Filed: 08/26/2010
• Issued: 05/22/2012
• Est. Priority Date: 09/02/2009
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Sato, Atsushi, Abe, Hisayuki, Ota, Takashi, Yanagida, Miyuki, Kameda, Masumi
• Primary Examiner(s): Nguyen, Hoa C
• Application Number:
  US12/869,095
• Publication Number:
  US 20110048774A1
• Time in Patent Office: 635 Days
• Field of Search: 361/760, 361/767, 174/255, 174/256, 174/257, 174/259, 174/263
• US Class Current: 174/257
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2203/1476 Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
• CPC Class Codes: H05K 3/244 Finish plating of conductors, especially of copper conductors, e.g. for pads or lands selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3457, e.g. by plating H05K3/3473
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 428/12458 having composition, density, or hardness gradient
• CPC Class Codes: Y10T 428/12889 Au-base component

Abstract

The present invention provides a plating film 50 including a nickel plating layer containing phosphorus and a gold plating layer formed on the nickel plating layer, wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, and wherein (3×σ×100)/X is 10 or less, where X and σ are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively; and a module substrate 100 having the plating film 50.

Claims

1. A plating film comprising:

a nickel plating layer containing phosphorus; and

a gold plating layer formed on the nickel plating layer;

wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %,

wherein (3×

σ

×

100)/X is 10 or less, where X and σ

are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively, and

wherein the phosphorus content in the nickel plating layer is higher as the gold plating layer is nearer.

2. A printed wiring board comprising a connection terminal having the plating film according to claim 1.

3. A module substrate comprising a connection terminal having the plating film according to claim 1 and an electronic instrument electrically connected to the connection terminal.

4. A plating film comprising:

a nickel plating layer containing phosphorus; and

a gold plating layer formed on the nickel plating layer;

wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, and

wherein (3×

σ

×

100)/X is equal or greater than 6.18 and is equal or less than 9.96, where X and σ

are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively.

5. The plating film according to claim 4, wherein the phosphorus content in the nickel plating layer is higher as the gold plating layer is nearer.

6. A printed wiring board comprising a connection terminal having the plating film according to claim 5.

7. A module substrate comprising a connection terminal having the plating film according to claim 5 and an electronic instrument electrically connected to the connection terminal.

8. A printed wiring board comprising a connection terminal having the plating film according to claim 4.

9. A module substrate comprising a connection terminal having the plating film according to claim 4 and an electronic instrument electrically connected to the connection terminal.

10. A plating film comprising:

a nickel plating layer containing phosphorus; and

a gold plating layer formed on the nickel plating layer;

wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %,

wherein (3×

σ

×

100)/X is 10 or less, where X and σ

are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively, and

wherein a range of P2/P1 is between 1.05-1.8, where P2 represents the mass percentage of the phosphorus content in the surface of the nickel plating layer on the gold plating layer side, and P1 represents the mass percentage of the phosphorus content in another surface of the nickel plating layer which is opposite to the surface on the gold plating layer side.

11. The plating film according to claim 10, wherein the phosphorus content in the nickel plating layer is higher as the gold plating layer is nearer.

12. A printed wiring board comprising a connection terminal having the plating film according to claim 11.

13. A module substrate comprising a connection terminal having the plating film according to claim 11 and an electronic instrument electrically connected to the connection terminal.

14. A printed wiring board comprising a connection terminal having the plating film according to claim 10.

15. A module substrate comprising a connection terminal having the plating film according to claim 10 and an electronic instrument electrically connected to the connection terminal.