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Stacked trench metal-oxide-semiconductor field effect transistor device

  • US 8,183,629 B2
  • Filed: 03/18/2008
  • Issued: 05/22/2012
  • Est. Priority Date: 05/13/2004
  • Status: Active Grant
First Claim
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1. An integrated circuit comprising:

  • a drain-side-gate trench metal-oxide-semiconductor field effect transistor including;

    a source region;

    a plurality of gate regions disposed above said source region, wherein said plurality of gate regions are formed as substantially parallel elongated structure;

    a plurality of gate insulator regions, wherein each of said plurality of gate insulator regions are disposed about a periphery of a respective one of said plurality of gate regions;

    a plurality of body regions disposed above said source region and between said plurality of gate insulator regions;

    a plurality of source-body contacts disposed between and electrically coupled to said source region and said plurality of body regions;

    a plurality of drift regions disposed above said plurality of body regions and between said plurality of gate insulator regions; and

    a plurality of drain regions disposed above said plurality of drift regions and between said plurality of gate insulator regions;

    a source-side-gate trench metal-oxide-semiconductor field effect transistor; and

    a metal lead coupling a drain of said source-side-gate trench metal-oxide-semiconductor field effect transistor to a source of said drain-side-gate trench metal-oxide-semiconductor field effect transistor.

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