Control device
First Claim
1. A modular control device comprising:
- a control board;
a sub-module having a sub-module case;
a wiring layer mounted into a wall of the sub-module case;
a plurality of electronic parts mounted in the sub-module case to electrically connect to the control board through the wiring layer;
a housing cover accommodating the control board and the sub-module; and
a housing base joined with the housing cover;
wherein,the wiring layer is configured as a plate having lower resistance wiring for the plurality of electronic parts than a circuit wiring of the control board;
at least two of the electronic parts mounted in the sub-module case have mutually different shapes;
accommodation portions having respective different shapes corresponding to the different shapes of each of the electronic parts are arranged on an inner surface of the housing cover;
a heat radiation fin is formed on an outer surface of the housing cover;
the sub-module is disposed between the housing cover and the control board and is mounted to the housing cover with a heat radiation adhesive between each of the accommodation portions and both upper and side surfaces of each of the electronic parts; and
the electronic parts are fixed by being sandwiched between an inner surface of the sub-module case and the inner surface of the housing cover by fastening the sub-module case and the housing cover to each other.
1 Assignment
0 Petitions
Accused Products
Abstract
A modular control device comprises a control board, a sub-module and a housing cover, with a microcomputer mounted on the control board. The sub-module has a sub-module case provided with a wiring layer that is mounted into a wall of the sub-module case. Electronic parts are mounted in the sub-module case to electrically connect to the control board through the wiring layer. A housing cover accommodates the control board and the sub-module. A housing base is joined with the housing cover. The accommodation portion has a shape corresponding to a shape of each of the electronic parts is arranged in the housing cover. The sub-module is mounted to the housing cover with a heat radiation adhesive between the accommodation portion and each of the electronic parts.
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Citations
8 Claims
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1. A modular control device comprising:
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a control board; a sub-module having a sub-module case; a wiring layer mounted into a wall of the sub-module case; a plurality of electronic parts mounted in the sub-module case to electrically connect to the control board through the wiring layer; a housing cover accommodating the control board and the sub-module; and a housing base joined with the housing cover;
wherein,the wiring layer is configured as a plate having lower resistance wiring for the plurality of electronic parts than a circuit wiring of the control board; at least two of the electronic parts mounted in the sub-module case have mutually different shapes; accommodation portions having respective different shapes corresponding to the different shapes of each of the electronic parts are arranged on an inner surface of the housing cover; a heat radiation fin is formed on an outer surface of the housing cover; the sub-module is disposed between the housing cover and the control board and is mounted to the housing cover with a heat radiation adhesive between each of the accommodation portions and both upper and side surfaces of each of the electronic parts; and the electronic parts are fixed by being sandwiched between an inner surface of the sub-module case and the inner surface of the housing cover by fastening the sub-module case and the housing cover to each other. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification