Method of mounting electronic component
First Claim
1. A method of mounting an electronic component, comprising:
- picking up a plurality of electronic components from a component feeding unit by suction using a plurality of suction nozzles of a mounting head;
detecting postures of the electronic components held by the suction nozzles of the mounting head;
releasing one of the electronic components that is held by one of the suction nozzles of the mounting head and judged improper as a result of the detecting;
taking, after the releasing of said one of the electronic components held by one of the suction nozzles of the mounting head, images of electronic components that are held by the suction nozzles of the mounting head and judged proper as the result of the detecting using a component recognition camera;
performing a recognition processing to the images taken by the component recognition camera;
releasing another of the electronic components that is held by another of the suction nozzles of the mounting head and judged improper as a result of the recognition processing;
mounting on a printed board electronic components that are held by the suction nozzles of the mounting head and judged proper as the result of the recognition processing after the releasing of said another of the improper electronic components held by another of the suction nozzles of the mounting head; and
after the mounting the electronic components, repeating the steps of the picking up of the electronic components, the detecting of the postures, the taking of the images and the performing of the recognition, wherein the electronic components judged proper by the detecting and the recognition processing are mounted on the printed board for a second time and the electronic components judged improper by the detecting or the recognition processing are released after the second mounting.
1 Assignment
0 Petitions
Accused Products
Abstract
The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.
6 Citations
1 Claim
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1. A method of mounting an electronic component, comprising:
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picking up a plurality of electronic components from a component feeding unit by suction using a plurality of suction nozzles of a mounting head; detecting postures of the electronic components held by the suction nozzles of the mounting head; releasing one of the electronic components that is held by one of the suction nozzles of the mounting head and judged improper as a result of the detecting; taking, after the releasing of said one of the electronic components held by one of the suction nozzles of the mounting head, images of electronic components that are held by the suction nozzles of the mounting head and judged proper as the result of the detecting using a component recognition camera; performing a recognition processing to the images taken by the component recognition camera; releasing another of the electronic components that is held by another of the suction nozzles of the mounting head and judged improper as a result of the recognition processing; mounting on a printed board electronic components that are held by the suction nozzles of the mounting head and judged proper as the result of the recognition processing after the releasing of said another of the improper electronic components held by another of the suction nozzles of the mounting head; and
after the mounting the electronic components, repeating the steps of the picking up of the electronic components, the detecting of the postures, the taking of the images and the performing of the recognition, wherein the electronic components judged proper by the detecting and the recognition processing are mounted on the printed board for a second time and the electronic components judged improper by the detecting or the recognition processing are released after the second mounting.
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Specification