Pressure sensor with on-board compensation

• US 8,186,226 B2
• Filed: 12/09/2009
• Issued: 05/29/2012
• Est. Priority Date: 12/09/2009
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Ricks, Lamar F.
• Primary Examiner(s): Caputo, Lisa
• Assistant Examiner(s): JENKINS, JERMAINE L
• Application Number:
  US12/634,551
• Publication Number:
  US 20110132096A1
• Time in Patent Office: 902 Days
• Field of Search: None
• US Class Current: 73/708
• CPC Class Codes: G01L 19/02 Arrangements for preventing, or for compensating for, effects of inclination or acceleration of the measuring device; Zero-setting means for aneroid barometers G01L7/14
• CPC Class Codes: G01L 9/065 with temperature compensating means non electric temperature compensating means G01L19/04

Abstract

The present disclosure relates generally to pressure sensors, and more particularly, to methods and apparatus for compensating pressure sensors for stress, temperature and/or other induced offsets and/or errors. In one illustrative embodiment, a pressure sensor may include a pressure sensing die mounted to a substrate of a pressure sensor package. The pressure sensor die may include on-board compensation. In some instances, the on-board compensation may include an on-board heating element and an on-board zener diode trim network, both situated on or in the pressure sensing die. The zener diode trim network may include one or more zener diodes and one or more resistive elements, where the zener diodes can be selectively activated to “trim” the resistive network to compensate for one or more offsets and/or errors of the pressure sensor. The on-board heating element may be configured to heat the pressure sensor assembly to various temperatures so that temperature related offsets and/or errors may be identified, and then compensated for with the zener diode trim network.

Claims

1. A pressure sensor, comprising:

a package substrate including a first side and a second side;

a pressure sensing die mounted relative to the first side of the package substrate, the pressure sensing die including;

a pressure sensing diaphragm;

one or more piezoresistive elements disposed on or adjacent to the pressure sensing diaphragm, wherein the one or more piezoresistive elements have a resistance that varies with an applied pressure to the pressure sensing diaphragm;

a zener diode trim network, wherein the zener diode trim network includes one or more zener diodes and one or more resistive elements, wherein the zener diode trim network is configured to be trimmed to compensate for one or more errors and/or offsets of the pressure sensor;

an on-board heating element, wherein the on-board heating element is configured to heat the pressure sensor when a current is applied to the heater element; and

a housing including a first housing member and a second housing member, the first housing member is mounted on the first side of the package substrate, the second housing member is mounted on the second side of the package substrate, wherein at least one of the first housing member and the second housing member has a pressure port for exposing the pressure sensing diaphragm of the pressure sensing die to a first input pressure.

2. The pressure sensor of claim 1, wherein the first housing member and the second housing member each have a pressure port for exposing the pressure sensing diaphragm to the first input pressure and a second input pressure, respectively.

3. The pressure sensor claim 1, wherein the first housing member has a pressure port for exposing a first side of the pressure sensing diaphragm to the first input pressure, and the second housing member is sealed to the package substrate to provide a reference pressure to a second side of the pressure sensing diaphragm.

4. The pressure sensor of claim 1, wherein the pressure sensor includes an amplification circuit for amplifying a signal received from the one or more piezoresistive elements.

5. The pressure sensor of claim 4, wherein the pressure sensing die is monolithic.

6. The pressure sensor of claim 1, wherein the pressure sensing die is monolithic.

7. The pressure sensor of claim 1, further comprising an application specific integrated circuit (ASIC) die mounted relative to the package substrate, wherein the ASIC doe includes signal conditioning circuitry for conditioning a signal received from the pressure sensing die.

8. The pressure sensor of claim 1, wherein the zener diodes of the zener diode trim network are reverse biased during operation.

9. The pressure sensor of claim 8, wherein each of the zener diodes are provided in parallel with at least one of the resistor elements.

10. The pressure sensor of claim 1, wherein the one or more zener diodes are NPN bipolar transistors with the base connected to the collector.

11. The pressure sensor of claim 10, wherein trimming the zener diode trim network includes applying a voltage greater than a breakdown voltage of one or more zener diodes to affect a desired change in resistance of the zener diode trim network.

12. A pressure sensor, comprising:

a pressure sensing die having a front side and a back side, wherein the back side is etched to form a pressure sensing diaphragm;

one or more piezoresistive elements disposed on or in the front side of the pressure sensing die on or adjacent to the pressure sensing diaphragm, wherein the one or more piezoresistive elements have a resistance that varies with an applied pressure to the pressure sensing diaphragm;

a trim network disposed on the first side of the pressure sensing die, wherein the trim network is configured to compensate for one or more errors and/or offsets in the pressure sensor when the trim network is trimmed, wherein the trim network has a first resistance prior to being trimmed and a second resistance after being trimmed, wherein the second resistance is less than the first resistance; and

an on-board heating element, wherein the on-board heating element is configured to heat the pressure sensing die when a current is applied to the heating element.

13. The pressure sensor of claim 12, further comprising;

an amplification circuit for amplifying a signal received from the one or more piezoresistive elements.

14. The pressure sensor of claim 12, further comprising:

a housing including one or more pressure ports for exposing the pressure sensing diaphragm to one or more pressures.

15. The pressure sensor of claim 12, wherein the trim network includes one or more zener diodes and one or more resistive elements, wherein the zener diodes of the trim network are reverse biased during operation.

16. The monolithic pressure sensor of claim 15, wherein the each of the zener diodes are provided in parallel with at least one of the resistor elements.

17. A method of compensating a pressure sensor for temperature induced errors and/or offsets, the method comprising:

providing a pressure sensor including a pressure sensing die defining a pressure sensing diaphragm, one or more piezoresistive elements disposed on the pressure sensing die on or adjacent to the pressure sensing diaphragm, a trim network disposed on the pressure sensing die, wherein the trim network is configured to compensate for one or more errors and/or offsets in the pressure sensor when the trim network is trimmed, wherein the trim network has a first resistance, and an on-board heating element, wherein the on-board heating element is configured to heat the pressure sensor when a current is applied;

activating the on-board heating element to heat the pressure sensor to a raised temperature; and

when the temperature of the pressure sensor reaches the raised temperature, decreasing the resistance of the trim network to a second resistance to compensate for temperature induced errors and/or offsets of the pressure sensor, the second resistance being lower than the first resistance.

18. The method of claim 17, further comprising:

providing an amplification circuit for amplifying a signal received from the one or more piezoresistive elements; and

decreasing the resistance of the trim network to a third resistance to compensate for amplification errors and/or offsets of the pressure sensor, the third resistance lower than the first resistance.

19. The method of claim 17, wherein the trim network includes one or more zener diodes and one or more resistive elements wherein the one or more zener diodes of the trim network are reverse biased during operation.

20. The method of claim 19, wherein decreasing the resistance of the trim network includes applying a voltage across one or more zener diodes of the trim network that is greater than the breakdown voltage of the one or more zener diodes to breakdown the one or more zener diodes, thereby shorting out one of the resistive elements.