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Durable glass housings/enclosures for electronic devices

  • US 8,187,987 B2
  • Filed: 08/21/2009
  • Issued: 05/29/2012
  • Est. Priority Date: 08/21/2008
  • Status: Expired due to Fees
First Claim
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1. An article suitable for housing, enclosing or covering the components of a portable electronic device, the article comprising an ion exchanged alkali-aluminosilicate glass consisting essentially of 64 mol %≦

  • SiO2

    68 mol %;

    12 mol %≦

    Na2O≦

    16 mol %;

    8 mol %≦

    Al2O3

    12 mol %;

    0 mol % ≦

    B2O3

    3 mol %;

    2 mol %≦

    K2O≦

    5 mol %;

    4 mol %≦

    MgO≦

    6 mol %; and

    0 mol %≦

    CaO≦

    5 mol %, wherein;

    66 mol %≦

    SiO2+B2O3 +CaO≦

    69 mol %;

    Na2O+K2O +B2O3+MgO+CaO+SrO>

    10 mol %;

    5 mol %≦

    MgO+CaO+SrO≦

    8 mol %;

    2 mol %≦

    Na2O−

    Al2O3

    6 mol %; and

    4 mol %≦

    (Na2O+K2O)−

    Al2O3

    10 mol %, and exhibiting radio and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz, infrared transparency, a fracture toughness of greater than 0.60 Mpa·

    m1/2, a 4-point bend strength of greater than 350 MPa, a Vickers hardness of at least 450 kgf/mm2, a Vickers median/radial crack initiation threshold of at least 5 kgf, a Young'"'"'s Modulus ranging between 50 to 100 GPa, a thermal conductivity of less than 2.0 W/m°

    C. and at least one of the following attributes;

    (i) a compressive surface layer having a depth of layer (DOL) greater than or equal to 20 μ

    m and a compressive stress greater than 400 MPa, or,(ii) a central tension of more than 20 MPa.

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