Durable glass housings/enclosures for electronic devices
First Claim
1. An article suitable for housing, enclosing or covering the components of a portable electronic device, the article comprising an ion exchanged alkali-aluminosilicate glass consisting essentially of 64 mol %≦
- SiO2≦
68 mol %;
12 mol %≦
Na2O≦
16 mol %;
8 mol %≦
Al2O3≦
12 mol %;
0 mol % ≦
B2O3≦
3 mol %;
2 mol %≦
K2O≦
5 mol %;
4 mol %≦
MgO≦
6 mol %; and
0 mol %≦
CaO≦
5 mol %, wherein;
66 mol %≦
SiO2+B2O3 +CaO≦
69 mol %;
Na2O+K2O +B2O3+MgO+CaO+SrO>
10 mol %;
5 mol %≦
MgO+CaO+SrO≦
8 mol %;
2 mol %≦
Na2O−
Al2O3≦
6 mol %; and
4 mol %≦
(Na2O+K2O)−
Al2O3≦
10 mol %, and exhibiting radio and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz, infrared transparency, a fracture toughness of greater than 0.60 Mpa·
m1/2, a 4-point bend strength of greater than 350 MPa, a Vickers hardness of at least 450 kgf/mm2, a Vickers median/radial crack initiation threshold of at least 5 kgf, a Young'"'"'s Modulus ranging between 50 to 100 GPa, a thermal conductivity of less than 2.0 W/m°
C. and at least one of the following attributes;
(i) a compressive surface layer having a depth of layer (DOL) greater than or equal to 20 μ
m and a compressive stress greater than 400 MPa, or,(ii) a central tension of more than 20 MPa.
1 Assignment
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Accused Products
Abstract
The invention relates to glass articles suitable for use as electronic device housing/enclosure or protective cover which comprise a glass material. Particularly, a housing/enclosure/cover comprising an ion-exchanged glass exhibiting the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa·m1/2; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf/mm2 and a Vickers median/radial crack initiation threshold of at least 5 kgf, (6) a Young'"'"'s Modulus ranging between about 50 to 100 GPa; (7) a thermal conductivity of less than 2.0 W/m° C., and (9) and at least one of the following attributes: (i) a compressive surface layer having a depth of layer (DOL) greater and a compressive stress greater than 400 MPa, or, (ii) a central tension of more than 20 MPa.
75 Citations
14 Claims
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1. An article suitable for housing, enclosing or covering the components of a portable electronic device, the article comprising an ion exchanged alkali-aluminosilicate glass consisting essentially of 64 mol %≦
- SiO2≦
68 mol %;
12 mol %≦
Na2O≦
16 mol %;
8 mol %≦
Al2O3≦
12 mol %;
0 mol % ≦
B2O3≦
3 mol %;
2 mol %≦
K2O≦
5 mol %;
4 mol %≦
MgO≦
6 mol %; and
0 mol %≦
CaO≦
5 mol %, wherein;
66 mol %≦
SiO2+B2O3 +CaO≦
69 mol %;
Na2O+K2O +B2O3+MgO+CaO+SrO>
10 mol %;
5 mol %≦
MgO+CaO+SrO≦
8 mol %;
2 mol %≦
Na2O−
Al2O3≦
6 mol %; and
4 mol %≦
(Na2O+K2O)−
Al2O3≦
10 mol %, and exhibiting radio and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz, infrared transparency, a fracture toughness of greater than 0.60 Mpa·
m1/2, a 4-point bend strength of greater than 350 MPa, a Vickers hardness of at least 450 kgf/mm2, a Vickers median/radial crack initiation threshold of at least 5 kgf, a Young'"'"'s Modulus ranging between 50 to 100 GPa, a thermal conductivity of less than 2.0 W/m°
C. and at least one of the following attributes;(i) a compressive surface layer having a depth of layer (DOL) greater than or equal to 20 μ
m and a compressive stress greater than 400 MPa, or,(ii) a central tension of more than 20 MPa. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
- SiO2≦
Specification