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Semiconductor device including leadframe having power bars and increased I/O

  • US 8,188,579 B1
  • Filed: 12/10/2010
  • Issued: 05/29/2012
  • Est. Priority Date: 11/21/2008
  • Status: Active Grant
First Claim
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1. A semiconductor package, comprising:

  • a generally planar die pad defining multiple peripheral edge segments;

    a plurality of first leads which are disposed in spaced relation to and at least partially circumvent the die pad;

    a plurality of second leads which are disposed in spaced relation to and at least partially circumvent the die pad, at least some of the first leads being disposed between the die pad and the second leads; and

    at least one power bar disposed in spaced relation to and extending between at least some of the first and second leads, the power bar partially but not fully circumventing the die pad.

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