×

Input/output package architectures

  • US 8,188,594 B2
  • Filed: 10/01/2009
  • Issued: 05/29/2012
  • Est. Priority Date: 09/29/2008
  • Status: Expired due to Fees
First Claim
Patent Images

1. An input/output (I/O) package architecture for an integrated circuit package substrate, comprising:

  • an integrated circuit (IC) package substrate including an integrated heat spreader (IHS) footprint on a die-side thereof; and

    an I/O trace to couple with an IC device to be disposed inside the IHS footprint, wherein the I/O trace includes a pin-out terminal outside the IHS footprint to couple to an IC device to be disposed outside the IHS footprint, wherein the I/O trace is capable of transmitting data between an IC device to be mounted inside the IHS footprint and an IC device to be located outside the IHS footprint at a signal rate between 5 Gb/s and 40 Gb/s.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×