RFID tag assembly methods
First Claim
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1. An RFID tag, comprising:
- an integrated circuit (IC);
an antenna; and
at least one capacitor providing the only coupling between electrical circuitry of the IC and the antenna, the at least one capacitor containing a dielectric material, wherein the dielectric material includes at least one of a covering layer of the IC and a covering layer of the antenna.
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Abstract
RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.
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Citations
7 Claims
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1. An RFID tag, comprising:
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an integrated circuit (IC); an antenna; and at least one capacitor providing the only coupling between electrical circuitry of the IC and the antenna, the at least one capacitor containing a dielectric material, wherein the dielectric material includes at least one of a covering layer of the IC and a covering layer of the antenna. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification