Image pick-up module and method for assembling such an image pick-up module

• US 8,189,062 B2
• Filed: 10/01/2008
• Issued: 05/29/2012
• Est. Priority Date: 05/27/1999
• Status: Expired due to Fees

• Current Assignee: Karl Storz Se & Co. Kg
• Original Assignee: Karl Storz Se & Co. Kg
• Inventors: Irion, Klaus M., Schwarz, Peter, Kocher, Mark, Kehr, Ulrich
• Primary Examiner(s): Aggarwal, Yogesh
• Application Number:
  US12/243,197
• Publication Number:
  US 20090027491A1
• Time in Patent Office: 1,336 Days
• Field of Search: 348/222.1, 348373-375, 348 45- 65, 348/72, 600/101, 600109-112
• US Class Current: 348/222.1
• CPC Class Codes: A61B 1/0011 Manufacturing of endoscope parts
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: H04N 23/50 Constructional details
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

Abstract

An image pick-up module comprises an electronic image sensor, single-piece circuit board electrically bonded to the image sensor, and at least one cable electrically bonded and leading away from the circuit board. The circuit board has at least three sections, first and second section extending in relation to the other and obliquely or crosswise to the image sensor, and third section arranged between first and second section. The image sensor is arranged on the circuit board opposite the third section. In a method for assembling the image pick-up module, the circuit board has the form of a planar board blank comprising at least three sections folded along flexible connecting sections whereby the at least one cable is bonded to the board, and the board folds whereby a third section is located between first and second section, and the image sensor is bonded to the circuit board opposite the third section.

Claims

1. An image pick-up module comprising:

an electronic image sensor;

a single-piece circuit board which is electrically bonded to said image sensor, said circuit board having at least four sections, with a first section and a second section extending in spaced relation one to the other and obliquely or crosswise to said image sensor and a third section being arranged between the first and the second sections, a fourth section arranged opposite said third section;

at least one cable electrically bonded to said circuit board and leading away from said circuit board;

said image sensor being arranged on top of said fourth section of said circuit board opposite said third section,

said fourth section comprising at least one electronic component arranged on a side of said fourth section opposite said image sensor.

2. The image pick-up module of claim 1, wherein said first and second sections extend substantially in parallel one to the other, and said third section extends obliquely or crosswise to said first and second sections.

3. The image pick-up module of claim 1, wherein said third section is curved.

4. The image pick-up module of claim 1, wherein said at least one cable is bonded to an inner surface of the circuit board.

5. The image pick-up module of claim 1, wherein said at least one cable is bonded to an outer surface of said circuit board.

6. The image pick-up module of claim 1, wherein said third section comprises at least one passage for said at least one cable leading away from said circuit board.

7. The image pick-up module of claim 6, wherein said at least one passage is configured as a marginal recess in said third section.

8. The image pick-up module of claim 1, wherein said third section comprises at least one passage for said at least one cable leading away from said circuit board, wherein said at least one passage is configured as a substantially central opening in said third section.

9. The image pick-up module of claim 1, wherein an interior of said circuit board, defined by said first, second and third sections, is filled with an electrically non-conductive feeling compound.

10. The image pick-up module of claim 1, wherein said circuit board comprises, in addition to said first section and said second section, at least one additional section arranged on one longitudinal side of said circuit board.

11. The image pick-up module of claim 1, wherein said circuit board is provided on its outer surface with recesses for bonding of said image sensor.

12. The image pick-up module of claim 1, wherein said third section of said circuit board comprises at least one contact for bonding said cable leading away from said circuit board.

13. The image pick-up module of claim 1, wherein said third section of said circuit board comprises at least one electric circuit-board conductor for electrically connecting said first section and said second section.

14. The image pick-up module of claim 1, wherein said circuit board is folded from a planar board blank comprising at least said integrally formed first, second and third sections.

15. The image pick-up module of claim 14, wherein said first section and said second section of said board blank are flexibly connected via an additional section, but are arranged in spaced relationship at one and the same level, wherein said first section and said second section each serve for bonding said at least one cable, and wherein said third section is flexibly connected to said additional section on an end face of said additional section.