Lead condition assessment for an implantable medical device
First Claim
1. A method for assessing a condition of a lead assembly coupled to an implantable medical device (IMD), the method comprising:
- determining by an impedance unit of the IMD or an external unit in communication with the IMD a first impedance relative to a first electrode and a reference electrode;
determining by the impedance unit of the IMD or the external unit in communication with the IMD a second impedance relative to a second electrode and the reference electrode;
comparing by the impedance unit of the IMD or the external unit in communication with the IMD the first impedance to the second impedance to determine an impedance difference;
determining by the impedance unit of the IMD or the external unit in communication with the IMD a position of the first electrode relative to the second electrode based on at least the impedance difference;
determining a third impedance, the third impedance comprising the impedance relative to the first electrode and the second electrode;
determining whether the impedance difference is outside a predetermined tolerance range;
comparing the impedance difference to the third impedance; and
identifying a source of a lead condition error based upon the comparing of the impedance difference to the third impedance, the source comprising at least one of the first electrode, the second electrode, and a physiological impedance.
2 Assignments
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Accused Products
Abstract
A method, system, and apparatus for performing a lead condition assessment and/or a lead orientation determination associated with an implantable medical device (IMD). A first impedance is determined. The first impedance relates to the impedance relative to a first electrode and a portion of the IMD. A second impedance is determined. The second impedance relates to the impedance relative to a second electrode and the portion of the IMD. The first impedance is compared with the second impedance to determine an impedance difference. A determination is made whether the impedance difference is outside a predetermined tolerance range. Furthermore, artifact measured during impedance measurements or test pulses may be compared to assess lead orientation. An indication of a lead condition error is provided in response to determining that the impedance difference is outside the predetermined tolerance range.
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Citations
20 Claims
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1. A method for assessing a condition of a lead assembly coupled to an implantable medical device (IMD), the method comprising:
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determining by an impedance unit of the IMD or an external unit in communication with the IMD a first impedance relative to a first electrode and a reference electrode; determining by the impedance unit of the IMD or the external unit in communication with the IMD a second impedance relative to a second electrode and the reference electrode; comparing by the impedance unit of the IMD or the external unit in communication with the IMD the first impedance to the second impedance to determine an impedance difference; determining by the impedance unit of the IMD or the external unit in communication with the IMD a position of the first electrode relative to the second electrode based on at least the impedance difference; determining a third impedance, the third impedance comprising the impedance relative to the first electrode and the second electrode; determining whether the impedance difference is outside a predetermined tolerance range; comparing the impedance difference to the third impedance; and identifying a source of a lead condition error based upon the comparing of the impedance difference to the third impedance, the source comprising at least one of the first electrode, the second electrode, and a physiological impedance. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method for determining a condition of a lead assembly associated with an implantable medical device (IMD) using an impedance unit of the IMD or an external unit in communication with the IMD, the method comprising:
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providing a first test signal from the IMD to a first electrode coupled to the IMD through a first lead; measuring a first signal artifact relating to a second electrode coupled to the IMD through a second lead, the first signal artifact resulting from the first test signal being applied to the first electrode; providing a second test signal from the IMD to the second electrode; measuring a second signal artifact relating to the first electrode, the second signal artifact resulting from the second test signal being applied to the second electrode; comparing the first signal artifact to the second signal artifact to determine a signal artifact differential; determining whether the signal artifact differential is outside a predetermined tolerance range; and providing an indication of a lead condition error in response to determining that the signal artifact differential is outside the predetermined tolerance range to a memory of the IMD or a communication unit of the IMD. - View Dependent Claims (17)
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18. An implantable medical device (IMD) comprising:
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a stimulation unit configured to deliver an electrical signal to a patient, wherein the stimulation unit is configured to be coupled to a first electrode, wherein the stimulation unit is configured to be coupled to a second electrode; an impedance unit configured to determine a first impedance between the first electrode and a reference electrode, wherein the impedance unit is configured to determine a second impedance between the second electrode and the reference electrode, wherein the impedance unit is configured to compare the first impedance to the second impedance to determine an impedance difference; a processor coupled to the impedance unit and configured to determine a position of the first electrode relative to the second electrode based on at least the impedance difference; and the impedance unit is further configured to determine a third impedance between the first electrode and the second electrode and to compare the impedance difference to the third impedance, wherein the processor is further configured to identify a source of lead condition error based on the comparison of the impedance difference to the third impedance, the source comprising at least one of the first electrode, the second electrode, and a physiological impedance. - View Dependent Claims (19, 20)
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Specification