Determining die performance by incorporating neighboring die performance metrics
First Claim
Patent Images
1. A method, comprising:
- receiving a first set of parameters measured for a plurality of die in a computing device;
determining a first die non-yield performance metric for a selected die based on a first subset of the first set of parameters in the computing device, the first subset including parameters measured for the selected die;
determining at least one neighborhood die non-yield performance metric associated with a set comprised of a plurality of additional die that neighbor the selected die based on a second subset of the first set of parameters in the computing device, the second subset including parameters measured for the additional die; and
determining a second die performance metric for the selected die based on a combination of the first die non-yield performance metric and the neighborhood die non-yield performance metric in the computing device.
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Abstract
A method includes receiving a first set of parameters associated with a plurality of die. A first die performance metric associated with a selected die is determined based on the first set of parameters. At least one neighborhood die performance metric associated with a set comprised of a plurality of die that neighbor the selected die is determined based on the first set of parameters. A second die performance metric is determined for the selected die based on the first die performance metric and the neighborhood die performance metric.
28 Citations
20 Claims
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1. A method, comprising:
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receiving a first set of parameters measured for a plurality of die in a computing device; determining a first die non-yield performance metric for a selected die based on a first subset of the first set of parameters in the computing device, the first subset including parameters measured for the selected die; determining at least one neighborhood die non-yield performance metric associated with a set comprised of a plurality of additional die that neighbor the selected die based on a second subset of the first set of parameters in the computing device, the second subset including parameters measured for the additional die; and determining a second die performance metric for the selected die based on a combination of the first die non-yield performance metric and the neighborhood die non-yield performance metric in the computing device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A system, comprising:
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a first metrology tool operable to measure a first set of parameters associated with a plurality of die; and a die performance unit operable to determine a first die non-yield performance metric for a selected die from the plurality of die based on a first subset of the first set of parameters, the first subset including parameters measured for the selected die, determine at least one neighborhood die non-yield performance metric associated with a set comprised of a plurality of die that neighbor the selected die based on a second subset of the first set of parameters, the second subset including parameters measured for the additional die, and determine a second die performance metric for the selected die based on a combination of the first die non-yield performance metric and the neighborhood die non-yield performance metric.
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20. A system, comprising:
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means for measuring a first set of parameters associated with a plurality of die; means for determining a first die non-yield performance metric for a selected die based on a first subset of the first set of parameters in the computing device, the first subset including parameters measured for the selected die; means for determining at least one neighborhood die non-yield performance metric associated with a set comprised of a plurality of additional die that neighbor the selected die based on a second subset of the first set of parameters in the computing device, the second subset including parameters measured for the additional die; and means for determining a second die performance metric for the selected die based on a combination of the first die non-yield performance metric and the neighborhood die non-yield performance metric.
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Specification