Method for manufacturing antenna

• US 8,191,231 B2
• Filed: 12/20/2010
• Issued: 06/05/2012
• Est. Priority Date: 08/20/2010
• Status: Active Grant

• Current Assignee: Wistron NeWeb Corporation (Wistron Corporation)
• Original Assignee: Wistron NeWeb Corporation (Wistron Corporation)
• Inventors: Lo, Wen-Kuei, Chang, Sheng-Chieh, Huang, Bau-Yi, Tsai, Chi-Wen, Hsu, Hsin-Hui, Wang, Tzuh-Suan
• Primary Examiner(s): Trinh, Minh
• Application Number:
  US12/972,873
• Publication Number:
  US 20120042505A1
• Time in Patent Office: 533 Days
• Field of Search: 295/921, 296/00, 29830-831, 29846-852, 343/700.MS, 343/876, 427/555, 455/575.1, 455/575.5, 216/13, 216/62, 216/66, 216/75, 3405721-5724
• US Class Current: 29/600
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/405 Radome integrated radiating elements
• CPC Class Codes: H01Q 1/42 Housings not intimately mechanically associated with radiating elements, e.g. radome
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

A method for manufacturing an antenna includes steps as follows. First, a substrate is provided, wherein a surface of the substrate has an antenna region. Then, the surface of the substrate is electroless plated with a metal medium, so that the surface is covered with the metal medium. Then, the metal medium is covered with a resist. Then, a portion of the resist in the antenna region is removed. Then, the antenna region is electroplated with metal material to form an antenna main body. Then, a remaining portion of the resist is removed, and excluding a portion of the metal medium in the antenna region, the other portion of the metal medium is also removed from the substrate.

Claims

1. A method for manufacturing an antenna, the method comprising:

providing a substrate, wherein a surface of the substrate has an antenna region;

electroless plating the surface of the substrate with a metal medium, so that the surface is covered with the metal medium;

covering the metal medium with a resist;

removing a portion of the resist in the antenna region;

electroplating the antenna region with metal material to form an antenna main body;

removing a remaining portion of the resist; and

excluding a portion of the metal medium in the antenna region, removing the other portion of the metal medium from the substrate.

2. The method of claim 1, wherein the antenna region has antenna pattern.

3. The method of claim 1, further comprising:

roughening the surface of the substrate.

4. The method of claim 1, further comprising:

forming a recess in the antenna region.

5. The method of claim 1, wherein the material of the metal medium is palladium or polymeric material.

6. The method of claim 1, further comprising:

exposing the portion of the metal medium to the antenna region by removing the portion of the resist in the antenna region.

7. The method of claim 1, wherein the remaining portion of the resist is removed through dry etching.

8. The method of claim 7, wherein the dry etching is laser carving.

9. The method of claim 1, wherein the metal material is copper, nickel or gold.