Method for attaching porous metal layer to a metal substrate
First Claim
1. A method for attaching a porous metal structure to a solid metal substrate, the method comprising:
- providing the porous metal structure;
providing the solid metal substrate of a first mass;
placing the porous metal structure against the substrate, thereby forming an assembly;
applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous metal structure and the substrate; and
after the applying step, changing the shape of the substrate by removing mass from the substrate to form the substrate having a second mass, the first mass being significantly greater than the second mass, whereby the substrate of the first mass exhibits greater thermal expansion when heated than would the substrate of the second mass.
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Accused Products
Abstract
A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, comprises providing a solid metal substrate; providing a porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous metal structure is disposed against the substrate, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous structure and the substrate; and removing mass from the substrate after the porous structure is bonded to the substrate, thereby finish processing the assembly.
86 Citations
20 Claims
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1. A method for attaching a porous metal structure to a solid metal substrate, the method comprising:
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providing the porous metal structure; providing the solid metal substrate of a first mass; placing the porous metal structure against the substrate, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous metal structure and the substrate; and after the applying step, changing the shape of the substrate by removing mass from the substrate to form the substrate having a second mass, the first mass being significantly greater than the second mass, whereby the substrate of the first mass exhibits greater thermal expansion when heated than would the substrate of the second mass. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for attaching a porous metal structure to a metal component of an orthopedic implant, the method comprising:
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providing the porous metal structure in a desired shape; providing the metal component having a first three dimensional shape and a bone-facing surface; placing the porous metal structure against the bone-facing surface of the metal component, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the metal component to metallurgically bond the porous metal structure and the metal component; and after the applying step, removing mass from the metal component to form the metal component having a second three dimensional shape that differs from the first three dimensional shape in at least one dimension. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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18. A method for attaching a porous metal structure to a metal substrate, the method comprising:
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providing the porous metal structure; providing the solid metal substrate of a first mass; placing the porous metal structure against the substrate, thereby forming an assembly; metallurgically bonding the porous metal structure and the substrate; and after the bonding step, changing the shape of the substrate by removing mass from the substrate to form the substrate having a second mass, the first mass being significantly greater than the second mass, whereby the substrate of the first mass exhibits greater thermal expansion during the bonding step than would the substrate of the second mass. - View Dependent Claims (19, 20)
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Specification