High efficiency solid-state light source and methods of use and manufacture

• US 8,192,053 B2
• Filed: 11/08/2004
• Issued: 06/05/2012
• Est. Priority Date: 05/08/2002
• Status: Active Grant

• Current Assignee: Phoseon Technology, Inc.
• Original Assignee: Phoseon Technology, Inc.
• Inventors: Owen, Mark D., McNeil, Tom, Vlach, Francois
• Primary Examiner(s): Lee, Jong-Suk (James)
• Assistant Examiner(s): Tsidulko, Mark
• Application Number:
  US10/984,589
• Publication Number:
  US 20050152146A1
• Time in Patent Office: 2,766 Days
• Field of Search: 362/294, 362/573, 362/227, 362/230, 362/231, 362/241, 362/301, 362/373, 362/800, 433/29, 315/247, 315/246, 315/209.R, 315/224, 315/292, 361/18, 361/62
• US Class Current: 362/294
• CPC Class Codes: A61L 2/0047 Ultraviolet radiation
• CPC Class Codes: A61L 2/10 Ultraviolet radiation
• CPC Class Codes: A61L 2/26 Accessories or devices or components used for biocidal treatment
• CPC Class Codes: A61L 2202/14 Means for controlling sterilisation processes, data processing, presentation and storage means, e.g. sensors, controllers, programs
• CPC Class Codes: A61L 2202/17 Combination with washing or cleaning means
• CPC Class Codes: A61L 9/20 Ultraviolet radiation
• CPC Class Codes: B41F 23/0409 Ultraviolet dryers
• CPC Class Codes: B41F 23/0453 by ultraviolet dryers
• CPC Class Codes: C02F 1/325 Irradiation devices or lamp constructions
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/00 Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems lighting fixtures combined with outlets for air-treatment systems F24F13/078
• CPC Class Codes: F21V 29/56 using liquid coolants F21V29/51 takes precedence
• CPC Class Codes: F21V 29/57 characterised by control arrangements
• CPC Class Codes: F21V 29/673 the fans being used for intake
• CPC Class Codes: G01N 21/8806 Specially adapted optical and illumination features
• CPC Class Codes: G03F 7/7005 by multiple sources, e.g. light-emitting diodes [LED] or light source arrays addressable array sources specially adapted to produce patterns without a mask G03F7/70391
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H05B 47/10 : Controlling the light source
• CPC Class Codes: H05B 47/165 : following a pre-assigned programmed sequence; Logic control [LC]

Abstract

A high-intensity light source is formed by a micro array of a semiconductor light source such as a LEDs, laser diodes, or VCSEL placed densely on a liquid or gas cooled thermally conductive substrate. The semiconductor devices are typically attached by a joining process to electrically conductive patterns on the substrate, and driven by a microprocessor controlled power supply. An optic element is placed over the micro array to achieve improved directionality, intensity, and/or spectral purity of the output beam. The light module may be used for such processes as, for example, fluorescence, inspection and measurement, photopolymerzation, ionization, sterilization, debris removal, and other photochemical processes.

Claims

1. A lighting fixture, comprising:

an array of solid-state light emitters including at least two modules, each module having a module array of multiple light emitters on a substrate, the substrates being electrically insulative and thermally conductive, the array mounted in the housing, wherein the solid-state light emitters are arranged on the substrates with a spacing determined by a required power density of a desired operation;

a transistor-based current source within the housing electrically coupled to the array of solid-state light emitters, the current source receiving power from a power supply and balancing DC current between light-emitters in each module array and among the modules arrays;

a heat sink attached to the housing arranged to dissipate heat from the array of solid-state light emitters; and

drive circuitry within the housing to control operation of the solid-state light emitters.

2. The lighting module of claim 1, further comprising a temperature sensor located within the housing.

3. The lighting module of claim 2, the temperature sensor electrically connected to the power supply through control circuitry.

4. The lighting module of claim 2, further comprising a temperature sensor read circuit.

5. The lighting module of claim 1, wherein the housing comprises a thermally conductive material.

6. The lighting module of claim 1, further comprising a fan arranged to blow air across the heat sink.

7. The lighting module of claim 1, further comprising a liquid channel thermally coupled to the heat sink.

8. The lighting module of claim 1, further comprising the multiple substrates arranged in a line to form a light bar.

9. The lighting module of claim 8, further comprising a motive means to move the light bar relative to a work surface.