Method for manufacturing multiple layers of waveguides

• US 8,192,638 B2
• Filed: 08/29/2008
• Issued: 06/05/2012
• Est. Priority Date: 10/18/2007
• Status: Expired due to Fees

• Current Assignee: BAE Systems Information and Electronic Systems Integration Incorporated (BAE Systems Plc)
• Original Assignee: BAE Systems Information and Electronic Systems Integration Incorporated (BAE Systems Plc)
• Inventors: Pomerene, Andrew T. S., Conway, Timothy J., Hill, Craig M., Jaso, Mark
• Primary Examiner(s): Vinh, Lan
• Assistant Examiner(s): KAUFMAN, DAVID Y
• Application Number:
  US12/517,692
• Publication Number:
  US 20100025364A1
• Time in Patent Office: 1,376 Days
• Field of Search: 385/129, 385/130, 385/131, 385/132, 216/24, 216/2, 216/37, 216/38, 216/39, 216/41
• US Class Current: 216/24
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: G02B 6/12002 Three-dimensional structures
• CPC Class Codes: G02B 6/1223 high refractive index type, i.e. high-contrast waveguides
• CPC Class Codes: G02B 6/132 by deposition of thin films
• CPC Class Codes: G02B 6/136 by etching

Abstract

A method for manufacturing multiple layers of waveguides is disclosed. Initially, a first cladding layer is deposited on a substrate, a first inner cladding layer is then deposited on the first cladding layer, and a first waveguide material is deposited on the first inner cladding layer. The first inner cladding layer and the first waveguide material are then selectively etched to form a first waveguide layer. Next, a second inner cladding layer followed by a second cladding layer are deposited on the first waveguide layer. The second inner cladding layer and the second cladding layer are removed by using a chemical-mechanical polishing process selective to the first waveguide material. A third inner cladding layer followed by a second waveguide material are deposited on the first waveguide material. The third inner cladding layer and the second waveguide material are then selectively etched to form a second waveguide layer. Finally, a fourth inner cladding layer followed by a third cladding layer are deposited on the second waveguide layer.

Claims

1. A method for manufacturing multiple layers of waveguides, said method comprising:

depositing a first cladding layer on a substrate, a first inner cladding layer on said first cladding layer, and a first waveguide material on said first inner cladding layer;

selectively etching said first inner cladding layer and said first waveguide material to form a first waveguide layer;

depositing a second inner cladding layer followed by a second cladding layer on said first waveguide layer;

removing said second inner cladding layer and planarizing said second cladding layer using a process selective to said first waveguide material to expose said first waveguide material;

depositing a third inner cladding layer followed by a second waveguide material on said first waveguide material;

selectively etching said third inner cladding layer and said second waveguide material to form a second waveguide layer; and

depositing a fourth inner cladding layer followed by a third cladding layer on said second waveguide layer.

2. The method of claim 1, wherein said removing is performed by a chemical-mechanical polishing process.

3. The method of claim 1, wherein said third inner cladding layer is utilized as etch stop between said first waveguide layer and said second waveguide layer.

4. The method of claim 1, wherein said first waveguide material includes silicon, germanium, silicon germanium alloy, chalcogenide glass, silicon oxynitride, erbium doped glass or silicon nitride.

5. The method of claim 1, wherein said inner cladding layers include silicon nitride, silicon oxynitride or erbimum dope glass.

6. The method of claim 1, wherein said cladding layers include silicon oxide.