Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices
First Claim
1. A modular package for a light emitting device, comprising:
- a leadframe having a top surface and including a central region having a bottom surface and having a first thickness between the top surface of the leadframe and the bottom surface of the central region wherein the central region comprises a plurality of electrically isolated die mounting regions that are configured to receive respective light emitting devices, the leadframe further including a first plurality of electrical leads that are electrically isolated from the die mounting regions of the central region and that extend laterally away from a first side of the central region, each of the first electrical leads including a first region proximate the central region and having a bottom surface and a second thickness from the top surface of the leadframe to the bottom surface of the electrical lead adjacent the central region, wherein the second thickness is less than the first thickness; and
a package body on the leadframe surrounding the central region and exposing bottom surfaces of the die mounting regions;
wherein each of the first electrical leads further comprises a second region distal from the central region, the second region having the first thickness;
wherein the package body is at least partially provided beneath the bottom surface of the first region of the lead and adjacent the bottom surface of the central region; and
wherein the leadframe comprises a plurality of second electrical leads adjacent a second side of the central region opposite the first side of the central region and that are not electrically connected to die mounting regions.
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Accused Products
Abstract
A modular package for a light emitting device includes a leadframe having a top surface and including a central region having a bottom surface and having a first thickness between the top surface of the leadframe and the bottom surface of the central region. The leadframe may further include an electrical lead extending away from the central region. The electrical lead has a bottom surface and has a second thickness from the top surface of the leadframe to the bottom surface of the electrical lead. The second thickness may be less than the first thickness. The package further includes a package body on the leadframe surrounding the central region and exposing the bottom surface of the central region. The package body may be at least partially provided beneath the bottom surface of the lead and adjacent the bottom surface of the central region. Methods of forming modular packages and leadframes are also disclosed.
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Citations
16 Claims
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1. A modular package for a light emitting device, comprising:
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a leadframe having a top surface and including a central region having a bottom surface and having a first thickness between the top surface of the leadframe and the bottom surface of the central region wherein the central region comprises a plurality of electrically isolated die mounting regions that are configured to receive respective light emitting devices, the leadframe further including a first plurality of electrical leads that are electrically isolated from the die mounting regions of the central region and that extend laterally away from a first side of the central region, each of the first electrical leads including a first region proximate the central region and having a bottom surface and a second thickness from the top surface of the leadframe to the bottom surface of the electrical lead adjacent the central region, wherein the second thickness is less than the first thickness; and a package body on the leadframe surrounding the central region and exposing bottom surfaces of the die mounting regions; wherein each of the first electrical leads further comprises a second region distal from the central region, the second region having the first thickness; wherein the package body is at least partially provided beneath the bottom surface of the first region of the lead and adjacent the bottom surface of the central region; and wherein the leadframe comprises a plurality of second electrical leads adjacent a second side of the central region opposite the first side of the central region and that are not electrically connected to die mounting regions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A modular package for a light emitting device, comprising:
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a leadframe having a top surface and including a central region having a bottom surface and having a first thickness between the top surface of the leadframe and the bottom surface of the central region, wherein the central region comprises a plurality of electrically isolated die mounting regions, the leadframe further including a plurality of first electrical leads that are electrically isolated from the die mounting regions of the central region and that extend laterally away from the respective die mounting regions of the central region, the first electrical leads each including a first region proximate the respective die mounting regions of the central region and having a bottom surface and a second thickness from the top surface of the leadframe to the bottom surface of the electrical lead adjacent the central region, wherein the second thickness is less than the first thickness; and a package body on the leadframe surrounding the central region and exposing the bottom surface of the central region; wherein each of the first electrical leads further comprises a second region distal from the central region, the second region having the first thickness; wherein the package body is at least partially provided beneath the bottom surface of the first region of the first electrical leads and adjacent the bottom surface of the central region; wherein the first electrical leads extend from a first side of the modular package; wherein the package includes a second side opposite the first side; and wherein the leadframe comprises a plurality of second electrical leads that are not electrically connected to die mounting regions and that extend from the second side of the package. - View Dependent Claims (13, 14)
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15. A leadframe for a package for a light emitting device, comprising:
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a top surface; a central region having a bottom surface and having a first thickness between the top surface of the leadframe and the bottom surface of the central region wherein the central region comprises a plurality of electrically isolated die mounting regions; and a first plurality of electrical leads that are electrically isolated from the die mounting regions of the central region and that extend laterally away from a first side of the central region and are electrically connected to the die mounting regions, each of the first plurality of electrical leads comprising; a first region proximate the respective die mounting regions of the central region and having a bottom surface and a second thickness from the top surface of the leadframe to the bottom surface of the electrical lead adjacent the central region, wherein the second thickness is less than the first thickness; and a second region distal from the central region, the second region having the second thickness; wherein the central region includes a second side opposite the first side; and wherein the leadframe comprises a plurality of second electrical leads adjacent the second side of the central region and that are not electrically connected to die mounting regions. - View Dependent Claims (16)
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Specification