Semiconductor chip assembly with post/base heat spreader and cavity in post
First Claim
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1. A semiconductor chip assembly, comprising:
- a semiconductor device;
an adhesive that includes an opening;
a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; and
a conductive trace that includes a pad and a terminal;
wherein a cavity in the post faces in the upward direction, extends into the opening, is defined by and laterally surrounded by the post and is covered by the post in the downward direction;
wherein the semiconductor device extends into the cavity and is covered by the cavity in the downward direction, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;
wherein the adhesive is mounted on and extends above the base, contacts the post and the base, is located outside the cavity, extends between the post and the pad, extends laterally from the post to or beyond the terminal and is sandwiched between the base and the pad;
wherein the conductive trace is located outside the cavity; and
wherein the post extends into the opening and is sandwiched between the base and the cavity and between the adhesive and the cavity, and the base extends below the semiconductor device and the pad.
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Accused Products
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The semiconductor device extends into a cavity in the post, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace is located outside the cavity and provides signal routing between a pad and a terminal.
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Citations
45 Claims
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1. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; and a conductive trace that includes a pad and a terminal; wherein a cavity in the post faces in the upward direction, extends into the opening, is defined by and laterally surrounded by the post and is covered by the post in the downward direction; wherein the semiconductor device extends into the cavity and is covered by the cavity in the downward direction, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, contacts the post and the base, is located outside the cavity, extends between the post and the pad, extends laterally from the post to or beyond the terminal and is sandwiched between the base and the pad; wherein the conductive trace is located outside the cavity; and wherein the post extends into the opening and is sandwiched between the base and the cavity and between the adhesive and the cavity, and the base extends below the semiconductor device and the pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; a substrate that includes a dielectric layer, wherein an aperture extends through the substrate; and a conductive trace that includes a pad and a terminal; wherein a cavity in the post faces in the upward direction, extends into the opening and the aperture, is defined by and laterally surrounded by the post and is covered by the post in the downward direction; wherein the semiconductor device is mounted on the post, extends into the cavity and is covered by the cavity in the downward direction, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, is located outside the cavity, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap, contacts and is sandwiched between the post and the dielectric layer in the gap and between the base and the dielectric layer outside the gap and extends laterally from the post to or beyond the terminal; wherein the substrate is mounted on the adhesive and extends above the base; wherein the conductive trace is located outside the cavity and the pad is mounted on and extends above the dielectric layer; and wherein the post extends into the opening and the aperture and is sandwiched between the base and the cavity and between the adhesive and the cavity, and the base extends below the semiconductor device, the adhesive, the substrate and the pad. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; a substrate that includes a dielectric layer, wherein an aperture extends through the substrate; a conductive trace includes a pad and a terminal; and an encapsulant; wherein a cavity in the post faces in the upward direction, extends into the opening and the aperture and below the pad and is located above the base, is defined by and laterally surrounded by the post and is covered by the post in the downward direction; wherein the semiconductor device is mounted on the post, is located within the cavity, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, is located outside the cavity, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap, contacts and is sandwiched between the post and the dielectric layer within the gap, contacts and is sandwiched between the base and the dielectric layer outside the gap, is sandwiched between the base and the pad outside the gap, extends above a bottom surface of the pad, is overlapped by the pad, extends laterally from the post to or beyond the terminal and extends to peripheral edges of the assembly; wherein the substrate is mounted on the adhesive, extends above the base and is located outside the cavity; wherein the conductive trace is located outside the cavity and the pad contacts and extends above the dielectric layer and overlaps the adhesive; wherein the encapsulant extends into the cavity and covers the semiconductor device in the upward direction; and wherein the post extends into the opening and the aperture and above and below the dielectric layer, is sandwiched between the base and the cavity and between the adhesive and the cavity and is coplanar with the pad above the dielectric layer and with the adhesive below the dielectric layer, and the base extends below the semiconductor device, the adhesive, the encapsulant, the substrate and the pad. - View Dependent Claims (32, 33, 34, 35)
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36. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; and a conductive trace that includes a pad and a terminal; wherein a cavity in the post faces in the upward direction, extends into the opening, is defined by and laterally surrounded by the post and is covered by the post in the downward direction; wherein the semiconductor device is mounted on the post, extends into the cavity and is covered by the cavity in the downward direction, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, contacts the post and the base, is located outside the cavity, is sandwiched between the base and the pad, extends laterally from the post to or beyond the terminal and extends to peripheral edges of the assembly; wherein the conductive trace is located outside the cavity; and wherein the post extends into the opening and is coplanar with the pad, and the base extends below the semiconductor device and the pad. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45)
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Specification