Shielded gate trench MOSFET device and fabrication
First Claim
1. A semiconductor device, comprising:
- a substrate;
an active gate trench in the substrate;
an asymmetric trench in the substrate; and
a top electrode and a bottom electrode disposed within the asymmetric trench;
wherein;
the asymmetric trench has a first trench wall that is adjacent to a termination region and a second trench wall that is adjacent to the active gate trench;
the asymmetric trench has an asymmetric region and a symmetric region;
in the asymmetric region, an oxide layer between the first trench wall and the top electrode is substantially thicker than an oxide layer between the second trench wall and the top electrode; and
in the symmetric region, an oxide layer between the first trench wall and the bottom electrode has substantially the same thickness as an oxide layer between the second trench wall and the bottom electrode.
2 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor device embodiment includes a substrate, an active gate trench in the substrate, and an asymmetric trench in the substrate. The asymmetric trench has a first trench wall and a second trench wall, the first trench wall is lined with oxide having a first thickness, and the second trench wall is lined with oxide having a second thickness that is different from the first thickness. Another semiconductor device embodiment includes a substrate, an active gate trench in the substrate; and a source polysilicon pickup trench in the substrate. The source polysilicon pickup trench includes a polysilicon electrode, and top surface of the polysilicon electrode is below a bottom of a body region. Another semiconductor device includes a substrate, an active gate trench in the substrate, the active gate trench has a first top gate electrode and a first bottom source electrode, and a gate runner trench comprising a second top gate electrode and a second bottom source electrode. The second top gate electrode is narrower than the second bottom source electrode.
41 Citations
11 Claims
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1. A semiconductor device, comprising:
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a substrate; an active gate trench in the substrate; an asymmetric trench in the substrate; and a top electrode and a bottom electrode disposed within the asymmetric trench;
wherein;the asymmetric trench has a first trench wall that is adjacent to a termination region and a second trench wall that is adjacent to the active gate trench; the asymmetric trench has an asymmetric region and a symmetric region; in the asymmetric region, an oxide layer between the first trench wall and the top electrode is substantially thicker than an oxide layer between the second trench wall and the top electrode; and in the symmetric region, an oxide layer between the first trench wall and the bottom electrode has substantially the same thickness as an oxide layer between the second trench wall and the bottom electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification