Acoustic device with low acoustic loss packaging

• US 8,193,597 B2
• Filed: 11/17/2009
• Issued: 06/05/2012
• Est. Priority Date: 11/17/2009
• Status: Expired due to Fees

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies Wireless IP Singapore Pte Limited (Broadcom, Inc.)
• Inventors: Beaudry, Bruce, LeClair, Timothy
• Primary Examiner(s): ARMAND, MARC ANTHONY
• Application Number:
  US12/619,963
• Publication Number:
  US 20110115037A1
• Time in Patent Office: 931 Days
• Field of Search: 257/416, 257/E29.324, 257/E21.613, 438/50, 438/52
• US Class Current: 257/416
• CPC Class Codes: B81B 2201/0292 Sensors not provided for in B81B2201/0207 - B81B2201/0285
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81C 2203/032 Gluing
• CPC Class Codes: B81C 2203/035 Soldering
• CPC Class Codes: G10K 11/004 Mounting transducers, e.g. provided with mechanical moving or orienting device mountings specially adapted to a particular sound-producing device, see the preceding groups G10K1/00 - G10K9/00, e.g. G10K1/26, G10K1/28, G10K9/22; arrangements of sonic watch equipment on submarines B63G8/39; buoys B63B22/00
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

A device includes: a substrate having an aperture therethrough from a first side of the substrate to a second side of the substrate; a semiconductor die having an acoustic transducer, the semiconductor die being provided on the first side of the substrate such that the acoustic transducer is aligned with the aperture in the substrate; and a dual in-line package having a recess formed therein. The substrate is disposed such that the first side of the substrate faces the recess of the dual in-line package, and the semiconductor die is disposed between the first side of the substrate and the bottom surface of the recess in the dual in-line package.

Claims

1. A device, comprising:

a first substrate having a first aperture therethrough from a first side of the first substrate to a second side of the first substrate;

a first semiconductor die having at least a first acoustic transducer, the first semiconductor die being provided on the first side of the first substrate such that the first acoustic transducer is aligned with the first aperture in the first substrate;

a second substrate having a second aperture therethrough from a first side of the second substrate to a second side of the second substrate;

a second semiconductor die having at least a second acoustic transducer, the second semiconductor die being provided on the first side of the second substrate such that the second acoustic transducer is aligned with the second aperture in the second substrate; and

a dual in-line package having a recess therein;

wherein the first and second substrates are mounted on the dual in-line package such that the second substrate is adjacent to, and in parallel with, the first substrate,

wherein the first sides of the first and second substrates, and the recess of the dual in-line package, together define a cavity, and

wherein the first and second semiconductor dies are disposed in the cavity.

2. The device of claim 1, further comprising at least one acoustic horn provided adjacent the second side of the first substrate, the acoustic horn having a first opening having a first diameter and a second opening opposite the first opening, the second opening having a second diameter greater than the first diameter, wherein the first opening is adjacent to and aligned with the first aperture in the first substrate.

3. The device of claim 1, wherein the first semiconductor die includes at least a pair of electrode pads connected to electrodes of the first acoustic transducer, and wherein a plurality of substrate pads are provided on the first side of the first substrate, the device further comprising a plurality of wire bonds electrically connecting the electrode pads of the first semiconductor die to the substrate pads of the first substrate.

4. The device of claim 1, wherein the first and second substrates are alumina substrate.

5. The device of claim 1, wherein at least one of the first and second semiconductor dies includes a second acoustic transducer,

6. The device of claim 1, wherein the dual in-line package includes a plurality of pins, the device further comprising a third substrate disposed at an opposite side of the dual in-line package as the recess in the dual in-line package, wherein the pins are directly connected to the third substrate.

7. The device of claim 1, wherein the first and second acoustic transducers each comprise a microelectromechanical systems (MEMS) membrane.

8. The device of claim 6, further comprising a TO-3 package, the TO-3 package including:

a TO-3 flange onto which the third substrate is mounted; and

a TO-3 can mounted on the flange and covering the first and second substrates, the first and second semiconductor dies, and the dual in-line package,

wherein the first and second substrates, the first and second semiconductor dies, and the dual in-line package are disposed in a space between the TO-3 flange and the TO-3 can.

9. A device, comprising:

a substrate having an aperture therethrough from a first side of the substrate to a second side of the substrate;

a semiconductor die having an acoustic transducer, the semiconductor die being provided on the first side of the substrate such that the acoustic transducer is aligned with the aperture in the substrate; and

a dual in-line package having a recess formed therein,

wherein the substrate is disposed such that the first side of the substrate faces the recess of the dual in-line package, and

wherein the semiconductor die is disposed between the first side of the substrate and a bottom surface of the recess in the dual in-line package.

10. The device of claim 9, further comprising an acoustic horn provided adjacent the second side of the substrate, the acoustic horn having a first opening adjacent to and aligned with the aperture in the substrate and having a second opening opposite the first opening.

11. The device of claim 9, wherein a plurality of substrate pads are provided on the first side of the substrate, the device further comprising a plurality of wire bonds electrically connecting the semiconductor die to the substrate pads.

12. The device of claim 9, wherein the substrate is a ceramic substrate.

13. The device of claim 9, wherein the semiconductor die includes a second acoustic transducer.

14. The device of claim 9, wherein the dual in-line package includes a plurality of pins, the device further comprising a second substrate, wherein the pins are connected to the second substrate.

15. The device of claim 14, further comprising a TO-3 package, the TO-3 package including:

a TO-3 flange onto which the second substrate is mounted; and

a TO-3 can mounted on the flange and covering the substrate, the semiconductor die, and the dual in-line package,

wherein the substrate, the semiconductor die, the dual in-line package are disposed in a space between the TO-3 flange and the TO-3 can.

16. A packaged device, comprising:

a packaging structure having a first side and a second side opposite the first side,

wherein the first side has a top surface with a recess formed therein, the recess having a bottom surface and an intermediate surface located at a level between the top surface and the bottom surface;

a substrate having a first side and a second side opposite the first side, wherein the first side of the substrate is disposed on the intermediate surface of the packaging structure such that the first side of the substrate is located closer than the second side of the substrate to the intermediate surface of the packaging structure, and wherein the packaging structure and the first side of the substrate define a cavity therebetween that is located at the first side of the substrate;

a semiconductor die having an acoustic device, the semiconductor die being disposed on the first side of the substrate within the cavity.

17. The packaged device of claim 16, wherein the semiconductor die includes a second acoustic device.

18. The packaged device of claim 16, wherein the packaging structure is a dual in-line package having a plurality of pins, the packaged device further comprising a second substrate, wherein the pins are connected to the second substrate.

19. The packaged device of claim 18, further comprising a TO-3 package, the TO-3 package including:

a TO-3 flange onto which the second substrate is mounted; and

a TO-3 can mounted on the flange and covering the substrate, the semiconductor die, and the dual in-line package,

wherein the substrate, the semiconductor die, the dual in-line package are disposed in a space between the TO-3 flange and the TO-3 can.

20. A packaged device, comprising:

a packing structure having a first side and a second side opposite the first side, wherein the first side has a top surface with a recess formed therein, the recess having a bottom surface and an intermediate surface located at a level between the top surface and the bottom surface;

a substrate having a first side and a second side opposite the first side, wherein first side of the substrate is disposed on the intermediate surface of the packaging structure such that the first side of the substrate is located closer than the second side of the substrate to the intermediate surface of the packaging structure, and wherein the packaging structure and the first side of the substrate define a cavity therebetween that is located at the first side of the substrate; and

a semiconductor die having an acoustic device, the semiconductor die being disposed on the first side of the substrate within the cavity,

wherein the substrate includes an aperture therethrough from a first side of the substrate to a second side of the substrate such that the acoustic device is aligned with the aperture in the substrate, the packaged device further comprising an acoustic horn provided adjacent the second side of the substrate, the acoustic horn having a first opening adjacent to and aligned with the aperture in the substrate.