×

Measuring method, inspection method, inspection device, semiconductor device, method of manufacturing a semiconductor device, and method of manufacturing an element substrate

  • US 8,193,827 B2
  • Filed: 03/30/2005
  • Issued: 06/05/2012
  • Est. Priority Date: 05/15/2001
  • Status: Active Grant
First Claim
Patent Images

1. A measuring method of a circuit or a circuit element, comprising:

  • applying a first voltage between a pair of terminals of a first coil;

    setting the first coil close to a second coil;

    operating the circuit or the circuit element by applying a second voltage generated between a pair of terminals of the second coil to the circuit or the circuit element; and

    reading a voltage output from the circuit or the circuit element in a non-contact manner,wherein the second coil and the circuit or the circuit element are formed over an insulating substrate.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×