Wireless IC device

• US 8,193,939 B2
• Filed: 02/23/2009
• Issued: 06/05/2012
• Est. Priority Date: 07/09/2007
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kato, Noboru, Ikemoto, Nobuo
• Primary Examiner(s): Mehmood, Jennifer
• Assistant Examiner(s): GIRMA, FEKADESELASS
• Application Number:
  US12/390,556
• Publication Number:
  US 20090146821A1
• Time in Patent Office: 1,198 Days
• Field of Search: None
• US Class Current: 340/572.7
• CPC Class Codes: G06K 19/041 Constructional details G06K19/06 takes precedence
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal

Abstract

A wireless-IC-device main component is disposed on a surface opposite to a surface for receiving signals from a reader/writer. The wireless-IC-device main component includes an insulating substrate, which is provided with a loop electrode and an electromagnetically coupled module coupled to the loop electrode. A signal from the reader/writer causes an eddy current to flow across a conductor principal plane of a metal article. The eddy current causes a magnetic field to be generated in a direction perpendicular or substantially perpendicular to the conductor principal plane of the metal article. Then, the loop electrode is coupled to the magnetic field. Thus, the wireless-IC-device main component functions as an RFID tag even for signals from the principal plane opposite to the wireless-IC-device main component. Thus, it is possible to reduce the cost of manufacturing a metal article, and to provide a wireless IC device using the metal article as a radiator.

Claims

1. A wireless IC device comprising:

a high-frequency device including a wireless IC chip, the high-frequency device is arranged to receive or transmit high-frequency signals in the UHF frequency band;

a radiation element defining a radiator;

a loop electrode coupled to the high-frequency device and the radiation element, and including a loop plane perpendicular or inclined relative to a plane of the radiation element;

wherein

the wireless IC chip and the loop electrode are electrically connected or electromagnetically coupled to one another;

the loop electrode is arranged to generate a magnetic field in a direction parallel or substantially parallel to the plane of the radiation element and to induce an electric field in a direction perpendicular or substantially perpendicular to the plane of the radiation element such that electric field loops induce magnetic field loops and the loop electrode and the radiation element are electromagnetically coupled to one another.

2. The wireless IC device according to claim 1, wherein the loop electrode is electromagnetically coupled to the radiation element with an insulating layer interposed therebetween.

3. The wireless IC device according to claim 1, wherein the loop electrode is directly electrically connected to the radiation element, and a portion of the radiation element functions as a portion of the loop electrode.

4. The wireless IC device according to claim 1, further comprising a matching circuit arranged between a mounting area of the high-frequency device and the loop electrode, the matching circuit being arranged to directly electrically connect the high-frequency device to the loop electrode.

5. The wireless IC device according to claim 1, wherein the at least one of the high-frequency device or the loop electrode is covered with plastic.

6. The wireless IC device according to claim 1, wherein the high-frequency device and the loop electrode are made of molded plastic disposed on the radiation element.

7. The wireless IC device according to claim 1, wherein the radiation element is a cylindrical or substantially cylindrical metal article having a conductive layer.

8. The wireless IC device according to claim 1, wherein the radiation element is defined by an electrode pattern provided on a circuit board inside an electronic equipment.

9. The wireless IC device according to claim 1, wherein the radiation element is defined by a metal plate provided in a component inside an electronic equipment.

10. The wireless IC device according to claim 1, wherein the loop electrode is disposed on a surface opposite to an electromagnetic wave transmission/reception surface outside the radiation element.

11. The wireless IC device according to claim 10, wherein the loop electrode is covered with the radiation element or a conductive surface including the radiation element.

12. The wireless IC device according to claim 1, wherein

the high-frequency device is an electromagnetically coupled module;

the electromagnetically coupled module includes the wireless IC chip and a feed circuit board;

the feed circuit board is coupled to the loop electrode; and

the feed circuit board is electrically connected or electromagnetically coupled to the wireless IC chip.

13. The wireless IC device according to claim 12 further comprising at least one of a resonant circuit or a matching circuit in the feed circuit board.

14. The wireless IC device according to claim 13, wherein a resonance frequency of the resonant circuit is substantially equal to a frequency of a signal transmitted and received by the radiation element.