Multilayer metamaterial isolator

• US 8,193,973 B2
• Filed: 06/23/2010
• Issued: 06/05/2012
• Est. Priority Date: 09/30/2008
• Status: Active Grant

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Morton, Matthew A., Buell, Kevin, Imhott, Jiyun C.
• Primary Examiner(s): Sotomayor, John B
• Application Number:
  US12/803,270
• Publication Number:
  US 20100263199A1
• Time in Patent Office: 713 Days
• Field of Search: 342/198, 342/175, 296/00, 343/700.MS, 343/909, 333/24.2
• US Class Current: 342/198
• CPC Class Codes: H01P 1/2005 Electromagnetic photonic bandgaps [EPB], or photonic bandgaps [PBG]
• CPC Class Codes: H01P 1/365 Resonance absorption isolators
• CPC Class Codes: H01Q 1/523 between antennas of an array
• CPC Class Codes: H01Q 15/0086 said selective devices having materials with a synthesized negative refractive index, e.g. metamaterials or left-handed materials
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

A method of fabricating an array of radiating elements includes on one layer or surface of a dielectric substrate, forming a first leg of a first resonator loop, on another layer or surface of the dielectric substrate forming a second leg of the first resonator loop between adjacent radiating elements, forming a via through the dielectric substrate, and metallizing the via forming a third leg of the first resonator loop interconnecting the first and second legs.

Claims

1. A method of fabricating an array of radiating elements, the method comprising:

on one layer or surface of a dielectric substrate, forming a first leg of a first resonator loop;

on another layer or surface of the dielectric substrate forming a second leg of the first resonator loop between adjacent radiating elements;

forming a via through the dielectric substrate; and

metallizing the via forming a third leg of the first resonator loop interconnecting the first and second legs,

fabricating a second resonator loop by;

forming a first leg adjacent the first leg of the first resonator loop,

forming a second leg adjacent the second leg of the first resonator loop, and

forming a third leg extending through the dielectric substrate interconnecting the first and second legs of the second resonator loop.

2. The method of claim 1 in which the adjacent radiating elements are formed on the same layer as the second leg.

3. The method of claim 1 further including forming interdigitated spaced fingers of the first and second resonator loops.

4. The method of claim 1 in which the first resonator loop constitutes a unit cell, the method further including forming a strip of adjacent unit cells.

5. A method to fabricate a multilayer metamaterial isolator, the method comprising:

on one layer or surface of a multilayer dielectric substrate, forming a first leg of a first resonator loop;

on another layer or surface of the multilayer dielectric substrate forming a second leg of the first resonator loop between adjacent radiating elements;

forming a via through the dielectric substrate; and

metallizing the via forming a third leg of the first resonator loop interconnecting the first and second legs.

6. The method of claim 5 in which the adjacent radiating elements are formed on the same layer as the second leg.

7. The method of claim 5, further comprising:

fabricating a second resonator loop by;

forming a first leg adjacent the first leg of the first resonator loop,

forming a second leg adjacent the second leg of the first resonator loop, and

forming a third leg extending through the dielectric substrate interconnecting the first and second legs of the second resonator loop.

8. The method of claim 7 further including forming interdigitated spaced fingers of the first and second resonator loops.

9. The method of claim 5 in which the first resonator loop constitutes a unit cell, the method further including forming a strip of adjacent unit cells.