Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
First Claim
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1. A computer-implemented method, comprising:
- generating electrical information for a device being fabricated on a wafer by processing design data for the device, wherein the design data cormprises physical layout information, three-dimensional structure information, netlist information, or some combination thereof; and
using the electrical information to perform one or more defect-related functions, wherein the one or more defect-related functions comprise one or more post-mask, defect-related functions, wherein the one or more defect-related functions further comprise using the electrical information and defect information generated by a defect review tool to determine electrical effects on the device due to defects detected on the wafer and using the electrical effects to determine a classification or ranking for the defects and wherein said generating and said using the electrical information are performed using a computer system.
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Abstract
Various methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions are provided. One computer-implemented method includes using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions. The one or more defect-related functions include one or more post-mask, defect-related functions.
396 Citations
85 Claims
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1. A computer-implemented method, comprising:
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generating electrical information for a device being fabricated on a wafer by processing design data for the device, wherein the design data cormprises physical layout information, three-dimensional structure information, netlist information, or some combination thereof; and using the electrical information to perform one or more defect-related functions, wherein the one or more defect-related functions comprise one or more post-mask, defect-related functions, wherein the one or more defect-related functions further comprise using the electrical information and defect information generated by a defect review tool to determine electrical effects on the device due to defects detected on the wafer and using the electrical effects to determine a classification or ranking for the defects and wherein said generating and said using the electrical information are performed using a computer system. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83)
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84. A non-transitory computer-readable medium, comprising program instructions executable on a computer system for performing a computer-implemented method, wherein the computer-implemented method comprises;
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generating electrical information for a device being fabricated on a wafer by processing design data for the device wherein the design data comprises physical layout information, three-dimensional structure information, netlist information, or some combination thereof; and using the electrical information to perform one or more defect-related functions, wherein the one or more defect-related functions comprise one or more post-mask, defect-related functions, and wherein the one or more defect-related functions further comprise using the electrical information and defect information generated by a defect review tool to determine electrical effects on the device due to defects detected on the wafer and using the electrical effects to determine a classification or ranking for the defects.
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85. A system configured to perform a computer-implemented method, comprising a computer system configured to perform the computer-implemented method, wherein the computer-implemented method comprises;
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generating electrical information for a device bein fabricated on a wafer by processing design data for the device, wherein the design data comprises physical layout information three-dimensional structure information netlist information, or some combination thereof; and using the electrical information to perform one or more defect-related functions, wherein the one or more defect-related functions comprise one or more post-mask, defect-related functions, and wherein the one or more defect-related functions further comprise using the electrical information and defect information generated by a defect review tool to determine electrical effects on the device due to defects detected on the wafer and using the electrical effects to determine a classification or ranking for the defects.
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Specification