Chip module, sim card, wireless device and wireless communication method
First Claim
1. A chip module comprising:
- a chip having at least one of memory and microprocessor functionalities;
a radiofrequency circuit;
at least one antenna element having a driving point and being connected to an RF-terminal of the radiofrequency circuit;
contact means operable to connect the chip directly through direct electric contact, the contact means comprising contact pads accessible from an outside of the chip module;
at least one dielectric substrate on which the chip, the radiofrequency circuit, the at least one antenna element, and the contact means are arranged;
wherein the driving point is separated from an edge of the chip module by at least 1 mm but not more than 11 mm;
wherein the chip module is essentially rectangular;
wherein the at least one antenna element is completely arranged in a half of the chip module where a major portion of the contact pads does not exist when considering the essentially rectangular shape divided in two equal portions by a line extending parallel to a short edge of a rectangle.
1 Assignment
0 Petitions
Accused Products
Abstract
The invention refers to a chip module comprising at least one memory and/or microprocessor chip and at least one antenna element connected to said chip. Further the invention relates to a SIM card comprising a dielectric substrate, eight or more contact pads provided on one side of said dielectric substrate, at least one memory and/or microprocessor chip provided on the other side of the substrate and connected to said contact pads, a first antenna element provided on the same side of the dielectric substrate as the chip, wherein the first antenna element has at least one driving point and at least one termination point, a second antenna element provided on the same side of the dielectric substrate as the first antenna element, wherein the first antenna element is given in an area different from the area where the contact pads are arranged, and the chip can be accessed by a wireless communication link with help of the antenna operating at a frequency of more than 800 MHz.
-
Citations
40 Claims
-
1. A chip module comprising:
-
a chip having at least one of memory and microprocessor functionalities; a radiofrequency circuit; at least one antenna element having a driving point and being connected to an RF-terminal of the radiofrequency circuit; contact means operable to connect the chip directly through direct electric contact, the contact means comprising contact pads accessible from an outside of the chip module; at least one dielectric substrate on which the chip, the radiofrequency circuit, the at least one antenna element, and the contact means are arranged; wherein the driving point is separated from an edge of the chip module by at least 1 mm but not more than 11 mm; wherein the chip module is essentially rectangular; wherein the at least one antenna element is completely arranged in a half of the chip module where a major portion of the contact pads does not exist when considering the essentially rectangular shape divided in two equal portions by a line extending parallel to a short edge of a rectangle. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
-
-
32. A wireless device comprising:
-
a first ground plane; a battery; and a chip module, the chip module comprising; a chip having at least one of memory and microprocessor functionalities; a radiofrequency circuit; and at least one antenna element having a driving point and being connected to an RF-terminal of the radiofrequency circuit; a second ground plane, the second ground plane acting in cooperation with the at least one antenna element; contact means operable to connect the chip directly through a direct electric contact, the contact means comprising contact pads accessible from an outside of the chip module; and at least one dielectric substrate on which the chip, the radiofrequency circuit, the at least one antenna element, the second ground plane, and the contact means are arranged. - View Dependent Claims (33, 34, 35, 36, 37, 38)
-
-
39. A method for wireless communication comprising:
-
establishing a wireless connection between a chip module of a wireless device and a device outside of the wireless device, the device being separated from the wireless device by more than a free space operating wavelength of the wireless device; reading out information from the at least one chip; wherein the chip module comprises; a chip having at least one of memory and microprocessor functionalities; a radiofrequency circuit; at least one antenna element having a driving point and being connected to an RF-terminal of the radiofrequency circuit; contact means operable to connect the chip directly through direct electric contact, the contact means comprising contact pads accessible from an outside of the chip module; and at least one dielectric substrate on which the chip, the radiofrequency circuit, the at least one antenna element, and the contact means are arranged; wherein the driving point is separated from an edge of the chip module by at least 1 mm and not more than 11 mm; and wherein the driving point is located not further away from the RF-terminal than 50 percent of a largest extension of the chip module. - View Dependent Claims (40)
-
Specification