Electronic component mounting module and electrical apparatus

• US 8,197,099 B2
• Filed: 11/25/2009
• Issued: 06/12/2012
• Est. Priority Date: 11/28/2008
• Status: Expired due to Fees

• Current Assignee: Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Original Assignee: Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Inventors: Oyaizu, Tsuyoshi, Kawashima, Seiko, Takei, Haruki, Matsui, Naoko
• Primary Examiner(s): Neils, Peggy A.
• Application Number:
  US12/625,917
• Publication Number:
  US 20100135034A1
• Time in Patent Office: 930 Days
• Field of Search: 362/294, 362/373, 362/249.02, 257/675, 361/704, 361/705, 361/707, 361/708, 361/719, 361/720
• US Class Current: 362/294
• CPC Class Codes: H01L 23/3736 Metallic materials H01L23/3732, H01L23/3733, H01L23/3735, H01L23/3737, H01L23/3738 take precedence
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 2201/10409 Screws
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/102 by bonding of conductive powder, i.e. metallic powder H05K3/12 takes precedence
• CPC Class Codes: H05K 7/20481 characterised by the material composition exhibiting specific thermal properties

Abstract

The invention provides an electronic component mounting module capable of increasing the adhesion between the board and the heat radiating member, improving the thermal conductivity, and effectively radiating heat generated from the LEDs being an electronic component. The LEDs are mounted on the surface of the ceramics board, and the rear surface 1b side of the board is disposed at the heat radiating member. A metallic fine particle layer having high thermal conductivity and flexibility is made to intervene between the board and the heat radiating member.

Claims

1. An electronic component mounting module including:

a ceramic board comprising a first surface and a second surface;

an LED, which generates heat when operating, mounted on the first surface of the ceramic board;

a heat radiating member comprising a surface, wherein the second surface of the ceramic board is disposed on the surface of the heat radiating member; and

a metallic fine particle layer comprising a plurality of metallic fine particles having gaps therebetween, having a layer thickness in a range from 3 μ

m through 50 μ

m, formed so as to be made to intervene between the second surface of the ceramic board and the surface of the heat radiating member, and deformed along an unevenness of the surface of the heat radiating member.

2. The electronic component mounting module according to claim 1, wherein the metallic fine particle layer is formed on the ceramic board.