Deposit morphology of electroplated copper
First Claim
Patent Images
1. A method comprising:
- providing a substrate having a copper seed layer;
spraying the copper seed layer with a pretreatment solution including an accelerator additive; and
depositing copper on the copper seed layer in a plating solution including substantially no accelerator additive.
0 Assignments
0 Petitions
Accused Products
Abstract
The present invention provides improved methods and devices for electroplating copper on a wafer. Some implementations of the present invention involve the pre-treatment of the wafer with a solution containing accelerator molecules. Preferably, the bath into which the wafer is subsequently placed for electroplating has a reduced concentration of accelerator molecules. The pre-treatment causes a reduction in roughness of the electroplated copper surface, particularly during the initial phases of copper growth.
-
Citations
20 Claims
-
1. A method comprising:
-
providing a substrate having a copper seed layer; spraying the copper seed layer with a pretreatment solution including an accelerator additive; and depositing copper on the copper seed layer in a plating solution including substantially no accelerator additive. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A method comprising:
-
providing a substrate having a surface having a copper seed layer; spraying the copper seed layer with a pretreatment solution including an accelerator additive; applying a DC cathodic current density through the surface to cathodically polarize the copper seed layer with respect to an electroplating solution, the electroplating solution including substantially no accelerator additive; and immersing the surface in the electroplating solution. - View Dependent Claims (9, 10, 11, 12, 13, 14)
-
-
15. A method comprising:
-
providing a substrate having a surface including a field region and a plurality of recessed features, the surface having a copper seed layer; spraying the surface with a pretreatment solution including an accelerator additive; immersing the surface in an electroplating solution including copper ions, a leveler additive, and substantially no accelerator additive; and applying a first DC cathodic current density through the surface, the first DC cathodic current density being sufficiently small such that depletion of the copper ions and the leveler additive is absent at the field region and at the plurality of recessed features. - View Dependent Claims (16, 17, 18, 19, 20)
-
Specification