Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination

• US 8,198,109 B2
• Filed: 03/09/2011
• Issued: 06/12/2012
• Est. Priority Date: 08/27/2010
• Status: Active Grant

• Current Assignee: Quarkstar LLC
• Original Assignee: Quarkstar LLC
• Inventors: Lerman, Louis, York, Allan Brent, Henry, Michael David, Steele, Robert, Ogonowsky, Brian D.
• Primary Examiner(s): Nguyen, Ha Tran T
• Assistant Examiner(s): CAMPBELL, SHAUN M
• Application Number:
  US13/044,456
• Publication Number:
  US 20110193114A1
• Time in Patent Office: 461 Days
• Field of Search: 438/25, 438/28, 257/91
• US Class Current: 438/28
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21S 8/06 by suspension
• CPC Class Codes: F21Y 2107/90 on two opposite sides of supports or substrates
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 2933/0075 relating to heat extraction or cooling elements
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01S 5/4025 Array arrangements, e.g. constituted by discrete laser diodes or laser bar H01S5/42 takes precedence

Abstract

A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. In another embodiment, a conductor layer is formed on the outer surface of the top substrate and makes contact with the LED electrodes and conductors on the bottom substrate via openings formed in the top substrate.

Claims

1. A method of forming a light emitting structure, the method comprising:

providing a first layer having a first conductor pattern formed thereon;

providing a plurality of non-packaged light emitting diode (LED) dies, each of the plurality of non-packaged LED dies having at least a corresponding first die electrode and a second die electrode;

bonding the first die electrode of each of the non-packaged LED dies to the first conductor pattern on the first layer without wire bonds, such that the plurality of non-packaged LED dies are spaced apart from one another;

disposing a light-transmissive sheet over the plurality of spaced-apart non-packaged LED dies, the sheet being formed of a dielectric material, such that the sheet deforms to conform to the plurality of spaced-apart non-packaged LED dies and contacts the first conductor pattern on the first layer between the plurality of spaced-apart non-packaged LED dies to separately encapsulate each of the plurality of non-packaged LED dies;

forming first openings in the sheet over the second die electrode of each of the plurality of spaced-apart non-packaged LED dies and second openings in the sheet over portions of the first conductor pattern where the first layer is in contact with the first conductor pattern;

forming a conductor layer overlying the sheet, such that the conductor layer is in electrical contact with the second die electrode of each of the plurality of spaced-apart non-packaged LED dies through the first openings and with the first conductor pattern through the second openings; and

patterning the conductor layer to connect at least a group of the plurality of spaced-apart non-packaged LED dies in series.

2. The method of claim 1, wherein forming the first and second openings comprises forming holes extending through the sheet prior to disposing the sheet over the plurality of spaced-apart non-packaged LED dies.

3. The method of claim 2, further comprising attaching metal studs to the second die electrodes and to the first conductor pattern prior to said disposing of the sheet over the plurality of spaced-apart non-packaged LED dies, the conductor layer that overlays the sheet is in electrical contact with the second die electrode of the plurality of spaced-apart non-packaged LED dies and with the first conductor pattern through the metal studs.

4. The method of claim 1 wherein said forming the conductor layer overlying the sheet comprises forming a seed layer and plating the seed layer.

5. The method of claim 1 wherein forming first openings in the sheet comprises laser drilling holes in the sheet.

10. The method of claim 1 further comprising providing a wavelength conversion layer overlying the plurality of spaced-apart non-packaged LED dies to cause the light emitting structure to emit white light during operation.

11. The method of claim 1 wherein the light emitting structure comprises a column of series-connected spaced-apart non-packaged LED dies.

6. A method of forming a light emitting structure, the method comprising:

providing a first layer having a first conductor pattern formed thereon;

providing a plurality of non-packaged light emitting diode (LED) dies, each of the plurality of non-packaged LED dies having at least a corresponding first die electrode and a second die electrode;

bonding the first die electrode of each of the non-packaged LED dies to the first conductor pattern on the first layer without wire bonds, such that the plurality of non-packaged LED dies are spaced apart from one another;

forming posts from a dielectric material over the second die electrodes of the plurality of spaced-apart non-packaged LED dies and over the first conductor pattern in between the plurality of spaced-apart non-packaged LED dies;

applying a flowable material over the plurality of spaced-apart non-packaged LED dies and around the posts to form a light-transmissive second layer of a dielectric material that conforms to the outer surfaces of the plurality of non-packaged LED dies and of the posts;

flattening a top surface of the second layer to expose the posts;

removing the posts to create first holes in the second layer over the second die electrodes of the plurality of spaced-apart non-packaged LED dies and second holes in the second layer over the first conductor pattern in between the plurality of spaced-apart non-packaged LED dies;

forming a conductor layer overlying the second layer, such that the conductor layer is in electrical contact with the second die electrode of the plurality of spaced-apart non-packaged LED dies through the first holes and with the first conductor pattern through the second holes; and

patterning the conductor layer to connect at least a group of the plurality of spaced-apart non-packaged LED dies in series.

7. The method of claim 6, wherein said forming the conductor layer overlying the second layer comprises forming a seed layer and plating the seed layer.

8. The method of claim 6, wherein said forming the conductor layer overlying the second layer comprises printing the conductor layer.

12. The method of claim 6, further comprising providing a wavelength conversion layer overlying the plurality of spaced-apart non-packaged LED dies to cause the light emitting structure to emit white light during operation.

13. The method of claim 6, wherein the light emitting structure comprises a column of series-connected non-packaged LED dies.

9. A method of forming a light emitting structure, the method comprising:

providing a first layer having a first conductor pattern formed thereon;

providing a plurality of non-packaged light emitting diode (LED) dies, each of the plurality of non-packaged LED dies having at least a corresponding first die electrode and a second die electrode;

bonding the first die electrode of each of the non-packaged LED dies to the first conductor pattern on the first layer without wire bonds, such that the plurality of non-packaged LED dies are spaced apart from one another;

forming a light-transmissive dielectric layer to encapsulate the plurality of spaced-apart non-packaged LED dies and the first conductor pattern and to cover the first layer;

forming first holes in the dielectric layer over the second die electrode of the plurality of spaced-apart non-packaged LED dies and second holes in the dielectric layer over the first conductor pattern in between the plurality of spaced-apart non-packaged LED dies;

forming trenches in a top surface of the dielectric layer to connect the formed first and second holes;

depositing a conductor layer over the dielectric layer; and

etching away a top portion of the conductor layer while leaving the conductor layer in the trenches and holes to interconnect the plurality of spaced-apart non-packaged LED dies in series.

14. The method of claim 9, wherein said depositing the conductor layer over the dielectric layer comprises forming a seed layer and plating the seed layer.

15. The method of claim 9, further comprising providing a wavelength conversion layer overlying the plurality of non-packaged LED dies to cause the light emitting structure to emit white light during operation.

16. The method of claim 9, wherein the light emitting structure comprises a column of series-connected non-packaged LED dies.