High reflectance terahertz mirror and related method
First Claim
1. A method comprising:
- forming a plurality of mirror periods, wherein at least one of the mirror periods is formed by;
bonding a first semiconductor layer to a first side of a film layer, a second semiconductor layer bonded to a second side of the film layer opposite the first side;
forming an opening through the second semiconductor layer to expose the film layer and form a notch in the second semiconductor layer, wherein remaining portions of the second semiconductor layer form sidewalls of the notch; and
cutting through the first semiconductor layer, the film layer, and the second semiconductor layer;
stacking the mirror periods; and
bonding the mirror periods together to form a high reflectance mirror, the notch in the at least one mirror period forming a cavity when the mirror periods are bonded together.
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Abstract
A method includes forming a plurality of mirror periods, stacking the mirror periods, and bonding the mirror periods together to form a high reflectance mirror. At least one of the mirror periods is formed by bonding a first semiconductor layer to a first side of a film layer (where the film layer is formed on a second semiconductor layer), forming an opening through the second semiconductor layer to expose the film layer, and cutting through the first semiconductor layer, the film layer, and the second semiconductor layer. The first semiconductor layer could include a high resistivity silicon wafer, the film layer could include an oxide film, and the second semiconductor layer could include a silicon wafer. The high resistivity silicon wafer could be approximately 110 μm thick, and the silicon wafer could be approximately 125 μm thick. The opening through the second semiconductor layer could be 1.25 cm to 1.75 cm in width.
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Citations
23 Claims
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1. A method comprising:
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forming a plurality of mirror periods, wherein at least one of the mirror periods is formed by; bonding a first semiconductor layer to a first side of a film layer, a second semiconductor layer bonded to a second side of the film layer opposite the first side; forming an opening through the second semiconductor layer to expose the film layer and form a notch in the second semiconductor layer, wherein remaining portions of the second semiconductor layer form sidewalls of the notch; and cutting through the first semiconductor layer, the film layer, and the second semiconductor layer; stacking the mirror periods; and bonding the mirror periods together to form a high reflectance mirror, the notch in the at least one mirror period forming a cavity when the mirror periods are bonded together. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An apparatus comprising:
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a plurality of mirror periods stacked and bonded together, each mirror period comprising; a first semiconductor layer bonded to a first side of a film layer; and a second semiconductor layer bonded to a second side of the film layer opposite the first side, the second semiconductor layer comprising an opening that exposes the film layer and forms a notch in the second semiconductor layer, wherein remaining portions of the second semiconductor layer form sidewalls of the notch; wherein the notches in at least some of the stacked mirror periods form cavities. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21)
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22. A method comprising:
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forming a semiconductor structure by fusion bonding a first wafer layer to a first side of an oxide film, a second wafer layer bonded to a second side of the oxide film opposite the first side; forming an aperture through the second wafer layer to expose the oxide film and form a notch in the second wafer layer, wherein remaining portions of the second wafer layer form sidewalls of the notch; dicing the semiconductor structure; and stack bonding a plurality of the diced semiconductor structures to form a high reflectance mirror, the notch in at least one diced semiconductor structure forming a cavity when the diced semiconductor structures are stack bonded. - View Dependent Claims (23)
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Specification