Over-current protection device
First Claim
1. An over-current protection device, comprising:
- two metal foils; and
a positive temperature coefficient (PTC) material layer sandwiched between the two metal foils, exhibiting a volume resistivity below 0.1 Ω
-cm, and comprising;
a plurality of crystalline polymers, wherein at least one of the crystalline polymers exhibits a melting point below 115°
C.; and
an electrically conductive nickel filler having a particle size from 0.1 μ
m to 15 μ
m and a volume resistivity below 500 μ
Ω
-cm; and
a non-conductive metal nitride filler;
wherein the electrically conductive nickel filler and the non-conductive metal nitride filler are dispersed in the crystalline polymers;
a packaging material layer covering the two metal foils and the PTC material layer and comprising epoxy resin formed by reacting with a hardener, the hardener comprising amide compound function group.
1 Assignment
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Accused Products
Abstract
An over-current protection device comprises two metal foils, a positive temperature coefficient (PTC) material layer and a packaging material layer. The PTC material layer is sandwiched between the two metal foils and has a volume resistivity below 0.1 Ω-cm. The PTC material layer includes (i) plural crystalline polymers having at least one crystalline polymer with a melting point less than 115° C.; (ii) an electrically conductive nickel filler having a volume resistivity less than 500 μΩ-cm; and (iii) a non-conductive metal nitride filler. The electrically conductive nickel filler and non-conductive metal nitride filler are dispersed in the crystalline polymer. The packaging material layer which encapsulates the chip is essentially comprised of the PTC layer and the two metal foils. The packaging material layer is formed by reacting epoxy resin with a hardener having amide functional group.
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Citations
19 Claims
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1. An over-current protection device, comprising:
-
two metal foils; and a positive temperature coefficient (PTC) material layer sandwiched between the two metal foils, exhibiting a volume resistivity below 0.1 Ω
-cm, and comprising;a plurality of crystalline polymers, wherein at least one of the crystalline polymers exhibits a melting point below 115°
C.; andan electrically conductive nickel filler having a particle size from 0.1 μ
m to 15 μ
m and a volume resistivity below 500 μ
Ω
-cm; anda non-conductive metal nitride filler; wherein the electrically conductive nickel filler and the non-conductive metal nitride filler are dispersed in the crystalline polymers; a packaging material layer covering the two metal foils and the PTC material layer and comprising epoxy resin formed by reacting with a hardener, the hardener comprising amide compound function group. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification