Method and system for a phased array antenna embedded in an integrated circuit package

• US 8,199,060 B2
• Filed: 02/01/2011
• Issued: 06/12/2012
• Est. Priority Date: 12/12/2007
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza, Rofougaran, Maryam
• Primary Examiner(s): LE, HOANGANH T
• Application Number:
  US13/019,007
• Publication Number:
  US 20110122037A1
• Time in Patent Office: 497 Days
• Field of Search: 343/700.MS, 343/795, 343/853, 343/864, 343/803
• US Class Current: 343/700.MS
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15321 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01Q 1/24 with receiving set
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 21/0093 : Monolithic arrays
• CPC Class Codes: H01Q 21/062 : using dipole aerials; H01Q21/067, H01Q21/068 take precedence
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 3/36 : with variable phase-shifters
• CPC Class Codes: H01Q 9/265 : Open ring dipoles; Circular dipoles

Abstract

Aspects of a method and system for configurable antenna in an integrated circuit package are provided. In this regard, a phased array antenna embedded in a multi-layer integrated circuit (IC) package may be utilized for transmitting and/or receiving signals. An IC enabled to transmit and/or receive signals may be bonded to the multi-layer IC package and may communicate a reference signal and/or one or more phase shifted versions of said reference signal to the antenna. One or more phase shifters (fabricated, for example, in planar transmission line) may be embedded in the multi-layer IC package and may be controlled via an IC bonded to the multi-layer IC package. The phased array antenna may comprise a plurality of antenna elements which may each comprise an interconnection for communicatively coupling to an associated transmitter and/or receiver, a feeder line, a quarter wavelength transformer, and a radiating portion (e.g., a folded dipole).

Claims

1. A method, comprising:

in an integrated circuit package, said integrated circuit package comprising a plurality of antenna elements and at least two phase shifters;

receiving a first signal via a bond wire and/or solder bump;

generating a plurality of phase-shifted signals from said first signal via at least two phase shifters; and

conveying each one of said phase-shifted signals to a corresponding one of said antenna elements.

2. The method according to claim 1, wherein each of said antenna elements comprises a folded dipole.

3. The method according to claim 2, wherein each of said antenna elements comprises a quarter-wavelength transformer coupled to said folded dipole.

4. The method according to claim 1, wherein:

said plurality of antenna elements comprises four antenna elements; and

said plurality of phase-shifted signals comprises four phase-shifted signals.

5. The method according to claim 1, wherein each of said antenna elements is constructed of planar transmission line.

6. A method, comprising:

in an integrated circuit package, said integrated circuit package comprising a plurality of antenna elements and at least two phase shifters;

receiving a plurality of signals via said plurality of antenna elements;

phase shifting each of said received signals via said at least two phase shifters to generate a plurality of phase-shifted signals;

combining said plurality of phase-shifted signals to generate a received signal; and

outputting said received signal via a bond wire and/or solder bump.

7. The method according to claim 6, wherein each of said antenna elements comprises a folded dipole.

8. The method according to claim 7, wherein each of said antenna elements comprises a quarter-wavelength transformer coupled to said folded dipole.

9. The method according to claim 6, wherein said plurality of antenna elements comprises four antenna elements.

10. The method according to claim 6, wherein each of said antenna elements is constructed of planar transmission line.

11. A system, comprising:

one or more circuits in an integrated circuit package, said one or more circuits comprising a plurality of antenna elements and at least two phase shifters, said one or more circuits being operable to;

receive a first signal via a bond wire and/or solder bump;

generate a plurality of phase-shifted signals from said first signal via said at least two phase shifters; and

convey each one of said phase-shifted signals to a corresponding one of said antenna elements.

12. The system according to claim 11, wherein each of said antenna elements comprises a folded dipole.

13. The system according to claim 11, wherein each of said antenna elements comprises a quarter-wavelength transformer coupled to said folded dipole.

14. The system according to claim 11, wherein:

said plurality of antenna elements comprises four antenna elements; and

said plurality of phase-shifted signals comprises four phase-shifted signals.

15. The system according to claim 11, wherein each of said antenna elements is constructed of planar transmission line.

16. A system, comprising:

one or more circuits in an integrated circuit package, said one or more circuits comprising a plurality of antenna elements and one or more phase shifters, said at least two circuits being operable to;

receive a plurality of signals via said plurality of antenna elements;

phase shift each of said received signals via said at least two phase shifters to generate a plurality of phase-shifted signals;

combine said plurality of phase-shifted signals to generate a received signal; and

output said received signal via a bond wire and/or solder bump.

17. The system according to claim 16, wherein each of said antenna elements comprises a folded dipole.

18. The system according to claim 17, wherein each of said antenna elements comprises a quarter-wavelength transformer coupled to said folded dipole.

19. The system according to claim 16, wherein said plurality of antenna elements comprises four antenna elements.

20. The system according to claim 16, wherein each of said antenna elements is constructed of planar transmission line.