Telephony and digital media services device

• US 8,199,507 B2
• Filed: 12/16/2009
• Issued: 06/12/2012
• Est. Priority Date: 12/19/2008
• Status: Expired due to Fees

• Current Assignee: OpenPeak LLC (Ni, Wang & Massand, PLLC)
• Original Assignee: OpenPeak Inc.
• Inventors: Theerawong, Teerapat, Shohet, Yuval
• Primary Examiner(s): SMITH, COURTNEY L
• Application Number:
  US12/639,175
• Publication Number:
  US 20100157543A1
• Time in Patent Office: 909 Days
• Field of Search: None
• US Class Current: 361/710
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: G06F 16/248 Presentation of query results
• CPC Class Codes: G06F 16/9535 Search customisation based on user profiles and personalisation
• CPC Class Codes: G06F 8/60 Software deployment
• CPC Class Codes: G06F 8/61 Installation
• CPC Class Codes: G06F 9/451 Execution arrangements for user interfaces
• CPC Class Codes: G06F 9/452 Remote windowing, e.g. X-Window System, desktop virtualisation protocols for virtual reality H04L67/131
• CPC Class Codes: G06Q 30/0601 Electronic shopping [e-shopping]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04W 4/60 Subscription-based services using application servers or record carriers, e.g. SIM application toolkits
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

An electronic device includes a housing, a printed circuit board, a first heat sink and a second heat sink. The printed circuit board is disposed internal to the housing and supports at least one integrated circuit (IC) chip. The first heat sink is also disposed internal to the housing and is thermally connected to the at least one IC chip. The second heat sink is connected to the housing such that at least a portion thereof is externally disposed to the housing. The second heat sink is thermally connected to the first heat sink via an aperture in the housing.

Claims

1. An electronic device comprising:

a housing;

a printed circuit board disposed internal to the housing that supports at least one integrated circuit (IC) chip;

a first heat sink disposed internal to the housing that is thermally connected to the at least one IC chip; and

a second heat sink connected to the housing such that at least a portion thereof is externally disposed to the housing and is unenclosed by any other device housing, the second heat sink being thermally connected to the first heat sink via an aperture in the housing,

wherein the second heat sink comprises a metallic stand that is connected to an external portion of the housing and that provides physical support for the electronic device when placed on a surface.

2. The device of claim 1, wherein the first heat sink is thermally connected to the at least one IC chip via a layer of silicon heat transfer compound.

3. The device of claim 1, wherein the second heat sink is thermally connected to the first heat sink via a layer of silicon heat transfer compound.

4. The device of claim 1, wherein the first heat sink comprises a metallic heat sink.

5. The device of claim 1, wherein the metallic stand is connected to a rear external portion of the housing.

6. A method for manufacturing an electronic device, comprising:

providing a housing;

disposing a printed circuit board that supports at least one integrated circuit (IC) chip internal to the housing;

disposing a first heat sink internal to the housing that is thermally connected to the at least one IC chip; and

connecting a second heat sink to the housing such that at least a portion of the second heat sink is externally disposed to the housing and is unenclosed by any other device housing, the second heat sink being thermally connected to the first heat sink via an aperture in the housing,

wherein connecting the second heat sink to the housing comprises connecting a metallic stand that provides physical support for the electronic device when placed on a surface to an external portion of the housing.

7. The method of claim 6, wherein the first heat sink is thermally connected to the at least one IC chip via a layer of silicon heat transfer compound.

8. The method of claim 6, wherein the second heat sink is thermally connected to the first heat sink via a layer of silicon heat transfer compound.

9. The method of claim 6, wherein disposing the first heat sink internal to the housing comprises disposing a metallic heat sink internal to the housing.

10. The method of claim 6, wherein connecting the metallic stand to an external portion of the housing comprises connecting the metallic stand to a rear external portion of the housing.

11. An electronic device comprising:

a housing;

a printed circuit board disposed internal to the housing that supports at least one integrated circuit (IC) chip;

a first heat sink disposed internal to the housing that is thermally connected to the at least one IC chip; and

a second heat sink disposed in an open air environment and thermally connected to the first heat sink via an aperture in the housing, the second heat sink comprising a metallic stand that is connected to an external portion of the housing and that provides physical support for the electronic device when placed on a surface.

12. An electronic device comprising:

a housing;

a printed circuit board disposed internal to the housing that supports at least one integrated circuit (IC) chip;

a first heat sink disposed internal to the housing that is thermally connected to the at least one IC chip; and

a second heat sink connected to the housing such that at least a portion thereof is externally disposed to the housing, the second heat sink being irremovably affixed to the first heat sink via an aperture in the housing, the second heat sink comprising a metallic stand that is connected to an external portion of the housing and that provides physical support for the electronic device when placed on a surface.