Single particle film etching mask and production method of single particle film etching mask, production method of micro structure with use of single particle film etching mask and micro structure produced by micro structure production method

• US 8,202,582 B2
• Filed: 06/21/2007
• Issued: 06/19/2012
• Est. Priority Date: 06/30/2006
• Status: Active Grant

• Current Assignee: OJI Paper Company Limited (Oji Holdings Corporation)
• Original Assignee: OJI Paper Company Limited (Oji Holdings Corporation)
• Inventors: Shinotsuka, Kei
• Primary Examiner(s): Deo, Duy
• Application Number:
  US12/306,476
• Publication Number:
  US 20090274873A1
• Time in Patent Office: 1,825 Days
• Field of Search: 216/42, 216/41, 216/56, 216/58, 438/156, 438/689, 438/694, 438/706, 428/143, 428/156, 427/372.2, 977/700
• US Class Current: 427/457
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: G02B 1/118 having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
• CPC Class Codes: G02F 1/133502 Antiglare, refractive index matching layers
• CPC Class Codes: G02F 2201/38 Anti-reflection arrangements
• CPC Class Codes: G03F 7/0002 Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
• CPC Class Codes: Y10T 428/24372 Particulate matter
• CPC Class Codes: Y10T 428/24479 including variation in thickness

Abstract

A micro structure which is preferred as an original plate of an antireflection, a mold of nano imprint or injection molding is obtained by a single particle film etching mask on which each particle is precisely aligned and closest packed in two dimensions. A single particle film etching mask is produced by a drip step wherein a dispersed liquid in which particles dispersed in a solvent are dripped onto a liquid surface of a water tank, a single particle film formation step in which a single particle film which consists of the particles by volatizing a solvent is formed, and a transfer step in which the single particle film is transferred to a substrate. The single particle film etching mask on which particles are closest packed in two dimensions, has a misalignment D(%) of an array of the particles that is defined by D(%)=|B−A|×100/A being less than or equal to 10%. However, A is the average diameter of the particles, and B is the average pitch between the particles in the single particle film.

Claims

1. A method of producing a single particle film etching mask comprising:

a drip step in which a dispersed liquid in which particles dispersed in a solvent are dripped onto a liquid surface of a water tank;

a single particle film formation step in which an ultrasonic sound irradiates from a substratum water of the water tank to the liquid surface of the water tank, and a single particle film including particles obtained by volatizing the solvent is formed; and

a transcription step in which the single particle film is transcribed to a substrate,

wherein an ultrasonic frequency of the ultrasonic sound is 700 kHz to 2 MHz.

2. A method of producing a micro structure comprising:

a drip step in which a dispersed liquid in which particles dispersed in a solvent are dripped onto a liquid surface of a water tank;

a single particle film formation step in which an ultrasonic sound irradiates from a substratum water of the water tank to the liquid surface of the water tank, and a single particle film including of particles obtained by volatizing the solvent is formed;

a transcription step in which the single particle film is transcribed to a substrate; and

an etching step in which the substrate is etched with gas-phase etching using the single particle film as an etching mask,

wherein an ultrasonic frequency of the ultrasonic sound is 700 kHz to 2 MHz.