Color control by alteration of wavelength converting element
First Claim
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1. A method comprising:
- providing a first bonding layer between a light emitting element and a wavelength converting member;
providing a second bonding layer between the wavelength converting member and an optical element, such that the first and second bonding layers are on opposite sides of the wavelength converting member;
bonding the light emitting element to the wavelength converting member with the first bonding layer; and
bonding the wavelength converting member to the optical element with the second bonding layer;
wherein the bonding of the wavelength converting member to the optical element occurs before bonding the light emitting element to the wavelength converting member.
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Abstract
A light emitting device is produced by depositing a layer of wavelength converting material over the light emitting device, testing the device to determine the wavelength spectrum produced and correcting the wavelength converting member to produce the desired wavelength spectrum. The wavelength converting member may be corrected by reducing or increasing the amount of wavelength converting material. In one embodiment, the amount of wavelength converting material in the wavelength converting member is reduced, e.g., through laser ablation or etching, to produce the desired wavelength spectrum.
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Citations
20 Claims
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1. A method comprising:
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providing a first bonding layer between a light emitting element and a wavelength converting member; providing a second bonding layer between the wavelength converting member and an optical element, such that the first and second bonding layers are on opposite sides of the wavelength converting member; bonding the light emitting element to the wavelength converting member with the first bonding layer; and bonding the wavelength converting member to the optical element with the second bonding layer; wherein the bonding of the wavelength converting member to the optical element occurs before bonding the light emitting element to the wavelength converting member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method comprising:
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providing a first bonding layer between a light emitting element and a wavelength converting member; providing a second bonding layer between the wavelength converting member and an optical element, such that the first and second bonding layers are on opposite sides of the wavelength converting member; bonding the light emitting element to the wavelength converting member with the first bonding layer; and bonding the wavelength converting member to the optical element with the second bonding layer; wherein the bonding of the light emitting element to the wavelength converting member and the bonding of the wavelength converting member to the optical element occur at approximately the same time.
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13. A method comprising:
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providing a first bonding layer between a light emitting element and a wavelength converting member; providing a second bonding layer between the wavelength converting member and an optical element, such that the first and second bonding lavers are on opposite sides of the wavelength converting member; bonding the light emitting element to the wavelength converting member with the first bonding layer; and bonding the wavelength converting member to the optical element with the second bonding layer; wherein the wavelength converting member comprises a corrected wavelength converting member, the corrected wavelength converting member is corrected to have an amount of wavelength converting material that is different than the amount of wavelength converting material initially coupled to the semiconductor light emitting element, the amount of wavelength converting material in the corrected wavelength converting member is sufficient to produce a desired wavelength spectrum. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification