Apparatus and method for exposing a substrate to a rotating irradiance pattern of UV radiation

• US 8,203,126 B2
• Filed: 07/22/2010
• Issued: 06/19/2012
• Est. Priority Date: 05/09/2005
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Rocha-Alvarez, Juan Carlos, Nowak, Thomas, Du Bois, Dale R., Baluja, Sanjeev, Hendrickson, Scott A., Ho, Dustin W., Kaszuba, Andrzei, Cho, Tom K.
• Primary Examiner(s): Wells, Nikita
• Application Number:
  US12/841,935
• Publication Number:
  US 20100285240A1
• Time in Patent Office: 698 Days
• Field of Search: 250/504.R, 250/365, 250/492.1, 250/492.2, 250/493.1
• US Class Current: 250/504.00R
• CPC Class Codes: B05D 3/0209 Multistage baking
• CPC Class Codes: B05D 3/0493 using vacuum
• CPC Class Codes: B05D 3/067 Curing or cross-linking the coating
• CPC Class Codes: H01L 21/31058 of organic layers
• CPC Class Codes: H01L 21/67115 mainly by radiation

Abstract

Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.

Claims

1. A method of curing a layer of dielectric material formed over a substrate, the method comprising:

placing the substrate having the dielectric material formed thereon on a substrate support in a substrate processing chamber;

exposing the substrate to ultraviolet radiation from a source of ultraviolet radiation that is spaced apart from the substrate support while rotating either the ultraviolet radiation source and/or substrate at least 180 degrees relative to each other during the exposing step.

2. The method of curing a layer of dielectric material set forth in claim 1 wherein the exposing step comprises rotating the ultraviolet radiation source at least 180 degrees.

3. The method of curing a layer of dielectric material set forth in claim 1 wherein exposing the step generates a substantially circular flood pattern having complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern during rotation during the exposing step that compensate for each other during rotation thereby providing a substantially uniform radiation pattern.

4. The method of curing a layer of dielectric material set forth in claim 3 wherein the substantially circular flood pattern comprises four areas of high intensity along the annular region near the outer periphery of the flood pattern, each of the four areas located at respective corners of a roughly square like pattern formed within the circular flood pattern.

5. The method of curing a layer of dielectric material set forth in claim 3 wherein the ultraviolet radiation is generated by first and second ultraviolet radiation lamps mounted facing each other at opposing angles relative to a vertical plane that intersects the substrate support.

6. The method of curing a layer of dielectric material set forth in claim 5 wherein each of the first and second ultraviolet radiation lamps are mounted at an angle of between 5-25 degrees relative to vertical plane.

7. The method of curing a layer of dielectric material set forth in claim 1 wherein exposing the step generates an irradiation pattern of ultraviolet radiation over the substrate, the irradiation pattern including a center region having a first intensity and an annular region surrounding the center region, the annular region including high intensity areas having a second intensity higher than the first intensity and low intensity areas having a third intensity lower than the first intensity.

8. The method of curing a layer of dielectric material set forth in claim 7 wherein the source of ultraviolet radiation is an elongated source of UV radiation and wherein the irradiation pattern of ultraviolet radiation is shaped by a pair primary reflectors partially surrounding the elongated source and a secondary reflector positioned between the primary reflector and the substrate support.

9. The method of curing a layer of dielectric material set forth in claim 8 wherein the primary reflectors are adapted to reflect ultraviolet radiation from the radiation source towards the substrate support and the secondary reflector is adapted to redirect ultraviolet radiation that would otherwise not contact the substrate towards the substrate the secondary reflector.

10. The method of curing a layer of dielectric material set forth in claim 8 wherein the primary reflectors and the secondary reflector combine to generate a substantially circular flood pattern or radiation.

11. The method of curing a layer of dielectric material set forth in claim 1 wherein the exposing step rotates the ultraviolet radiation source.

12. The method of curing a layer of dielectric material set forth in claim 1 wherein the exposing step generates a substantially circular flood pattern of radiation having high and low intensity areas along an annular region near an outer periphery of the flood pattern.

13. The method of curing a layer of dielectric material set forth in claim 12 wherein the substantially circular flood pattern of radiation further includes a central area within a first intensity range and wherein the radiation intensity within the high intensity area along the annular region is greater than the first intensity range and the radiation intensity within the low intensity area along the annular region is less than the first intensity range.

14. The method of curing a layer of dielectric material set forth in claim 13 wherein during the exposing step the high and low intensity areas combine to a value within the first intensity range.

15. The method of curing a layer of dielectric material set forth in claim 14 wherein the irradiation pattern of ultraviolet radiation is shaped by a first reflector that partially surrounds the source of ultraviolet radiation and a second reflector positioned between the first reflector and the substrate support.