Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal

• US 8,203,167 B2
• Filed: 07/10/2010
• Issued: 06/19/2012
• Est. Priority Date: 03/25/2008
• Status: Expired due to Fees

• Current Assignee: Bridge Semiconductor Corporation
• Original Assignee: Bridge Semiconductor Corporation
• Inventors: Lin, Charles W. C., Wang, Chia-Chung
• Primary Examiner(s): Nguyen, Dao H
• Assistant Examiner(s): Nguyen, Tram H
• Application Number:
  US12/833,945
• Publication Number:
  US 20100289054A1
• Time in Patent Office: 710 Days
• Field of Search: 257/99, 257/E33.056, 257/E33.066, 257/E23.101, 257/E23.102, 257/E23.01, 257/707, 257/713, 257/784, 257/684, 257/712, 257/711, 257/E33.075, 438/26, 438/27, 438/122, 438/39, 438/121, 438/118, 438/464, 438/669, 438/670
• US Class Current: 257/99
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32013 the layer connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a thermal post and a base. The thermal post extends upwardly from the base into a first opening in the adhesive, and the base extends laterally from the thermal post. The conductive trace includes a pad, a terminal and a signal post. The signal post extends upwardly from the terminal into a second opening in the adhesive. The adhesive extends above the base and between the base and the terminal.

Claims

1. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes first and second openings;

a heat spreader that includes a thermal post and a base, wherein the thermal post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the thermal post in a downward direction opposite the upward direction, covers the thermal post in the downward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions; and

a conductive trace that includes a pad, a terminal and a signal post, wherein the signal post extends below the pad and above the terminal and an electrically conductive path between the pad and the terminal includes the signal post;

wherein the semiconductor device overlaps the thermal post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the thermal post and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base and the terminal, extends laterally from the thermal post to or beyond the terminal and extends laterally between the base and the terminal;

wherein the pad extends above the signal post and the terminal extends below the signal post; and

wherein the thermal post extends into the first opening, the signal post extends into the second opening, the posts are the same metallic material and have the same thickness and are coplanar with one another, and the base and the terminal are the same metallic material and have the same thickness and are coplanar with one another.

2. The assembly of claim 1, wherein the semiconductor device is an LED chip.

3. The assembly of claim 1, wherein the semiconductor device is electrically connected to the pad using a wire bond and is thermally connected to the heat spreader using a die attach.

4. The assembly of claim 1, wherein the adhesive contacts the posts, the base and the terminal.

5. The assembly of claim 1, wherein the adhesive covers and surrounds the posts in the lateral directions.

6. The assembly of claim 1, wherein the adhesive conformally coats sidewalls of the posts, the base and the terminal.

7. The assembly of claim 1, wherein the adhesive is coplanar with tops of the posts.

8. The assembly of claim 1, wherein the adhesive extends laterally from the thermal post beyond the terminal.

9. The assembly of claim 1, wherein the adhesive extends to peripheral edges of the assembly.

10. The assembly of claim 1, wherein the posts are coplanar with the adhesive between top and bottom surfaces of the pad.

11. The assembly of claim 1, wherein the thermal post has a diameter that decreases as it extends upwardly from the base to its flat top, and the signal post has a diameter that decreases as it extends upwardly from the terminal to its flat top.

12. The assembly of claim 1, wherein the thermal post fills and is contained within the first opening and the signal post fills and is contained within the second opening.

13. The assembly of claim 1, wherein the terminal is adjacent to and integral with and located below the signal post and extends laterally from the signal post in the lateral directions.

14. The assembly of claim 1, wherein the base covers the thermal post in the downward direction, supports the adhesive and is spaced from peripheral edges of the assembly.

15. The assembly of claim 1, wherein the heat spreader includes a cap that extends is above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the thermal post and that contacts and overlaps the adhesive.

16. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes first and second openings;

a heat spreader that includes a thermal post and a base, wherein the thermal post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the thermal post in a downward direction opposite the upward direction, covers the thermal post in the downward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions;

a substrate that includes a dielectric layer, wherein first and second apertures extend through the substrate; and

a conductive trace that includes a pad, a terminal and a signal post, wherein the signal post is adjacent to the pad and the terminal, extends below the pad and extends above the terminal and an electrically conductive path between the pad and the terminal includes the signal post;

wherein the semiconductor device is mounted on the heat spreader, overlaps the thermal post, does not overlap the signal post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the thermal post and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base and the terminal, extends between the thermal post and the substrate, extends between the signal post and the substrate, extends laterally from the thermal post to or beyond the terminal, extends laterally between the base and the terminal below and outside peripheries of the posts and is sandwiched between the thermal post and the dielectric layer, between the signal post and the dielectric layer, between the base and the dielectric layer, between the terminal and the dielectric layer and between the base and the terminal;

wherein the substrate is mounted on the adhesive and extends above the base and the terminal;

wherein the pad extends above the adhesive, the dielectric layer and the signal post and the terminal extends below the dielectric layer and the signal post; and

wherein the thermal post extends into the first opening and the first aperture, the signal post extends into the second opening and the second aperture, the posts are the same metallic material and have the same thickness and are coplanar with one another, and the base and the terminal are the same metallic material and have the same thickness and are coplanar with one another.

17. The assembly of claim 16, wherein the semiconductor device is an LED chip.

18. The assembly of claim 16, wherein the semiconductor device is a semiconductor chip, is mounted on the heat spreader using a die attach, is electrically connected to the pad using a wire bond and is thermally connected to the heat spreader using the die attach.

19. The assembly of claim 16, wherein the adhesive contacts the posts, the base, the terminal and the dielectric layer.

20. The assembly of claim 16, wherein the adhesive covers and surrounds the posts in the lateral directions, conformally coats sidewalls of the posts, the base and the terminal, surrounds the base in the lateral directions and does not surround the terminal in the lateral directions.

21. The assembly of claim 16, wherein the adhesive extends to peripheral edges of the assembly.

22. The assembly of claim 16, wherein the adhesive is coplanar with tops of the posts.

23. The assembly of claim 16, wherein the posts are coplanar with the adhesive above the dielectric layer.

24. The assembly of claim 16, wherein the posts are coplanar with the adhesive between top and bottom surfaces of the pad.

25. The assembly of claim 16, wherein the thermal post has a diameter that decreases as it extends upwardly from the base to its flat top, and the signal post has a diameter that decreases as it extends upwardly from the terminal to its flat top.

26. The assembly of claim 16, wherein the thermal post fills and is contained within the first opening and the signal post fills and is contained within the second opening.

27. The assembly of claim 16, wherein the thermal post and the adhesive in combination fill the first aperture and the signal post and the adhesive in combination fill the second aperture, the conductive trace is spaced from the heat spreader, the pad contacts the dielectric layer, the terminal contacts the adhesive and is spaced from the dielectric layer and the posts contact the adhesive and are spaced from the dielectric layer.

28. The assembly of claim 16, wherein the substrate is a laminated structure that includes the pad.

29. The assembly of claim 16, wherein a cap extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the thermal post and contacts and overlaps the adhesive and the dielectric layer.

30. The assembly of claim 29, wherein the cap is coplanar with the pad above the adhesive and the dielectric layer, covers the opening and the aperture in the upward direction and is adjacent to the thermal post between top and bottom surfaces of the pad.

31. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes first and second openings;

a heat spreader that includes a thermal post, a base and a cap, wherein the thermal post is adjacent to and integral with the base, extends above the base in an upward direction and thermally connects the base and the cap, the base extends below the thermal post in a downward direction opposite the upward direction, covers the thermal post in the downward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the thermal post;

a substrate that includes a dielectric layer, wherein first and second apertures extend through the substrate; and

a conductive trace that includes a pad, a terminal and a signal post, wherein the signal post is adjacent to the pad and the terminal, extends below the pad and extends above the terminal and an electrically conductive path between the pad and the terminal includes the signal post;

wherein the semiconductor device is mounted on the cap, overlaps the thermal post, does not overlap the signal post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base and the terminal, extends into a first gap in the first aperture between the thermal post and the substrate and into a second gap in the second aperture between the signal post and the substrate, extends across the dielectric layer in the gaps, extends laterally from the thermal post to or beyond the terminal, extends laterally between the base and the terminal below the posts and outside peripheries of the posts, the base and the terminal, extends to peripheral edges of the assembly, covers and surrounds the posts in the lateral directions and contacts and is sandwiched between the thermal post and the dielectric layer in the first gap, between the signal post and the dielectric layer in the second gap, between the base and the dielectric layer outside the gaps, between the terminal and the dielectric layer outside the gaps and between the base and the terminal outside the gaps;

wherein the substrate is mounted on the adhesive and extends above the base and the terminal and the dielectric layer contacts the pad and is spaced from the posts, the base and the terminal;

wherein the pad extends above the adhesive, the dielectric layer and the signal post and the terminal extends below the dielectric layer and the signal post; and

wherein the thermal post extends into the first opening and the first aperture, the signal post extends into the second opening and the second aperture, the cap contacts and overlaps the adhesive and the dielectric layer and is coplanar with the pad above the adhesive and the dielectric layer at a surface that faces in the upward direction, the posts are the same metallic material and have the same thickness and are coplanar with one another and extend through the dielectric layer, and the base and the terminal are the same metallic material and have the same thickness and are coplanar with one another.

32. The assembly of claim 31, wherein the posts are coplanar with the adhesive above the dielectric layer between top and bottom surfaces of the pad.

33. The assembly of claim 31, wherein the thermal post fills and is contained within the first opening, the signal post fills and is contained within the second opening, the thermal post and the adhesive in combination fill the first aperture, the signal post and the adhesive in combination fill the second aperture and the posts are copper.

34. The assembly of claim 31, wherein the thermal post has a diameter that decreases as it extends upwardly from the base to the cap, the signal post has a diameter that decreases as it extends upwardly from the terminal to the pad.

35. The assembly of claim 31, wherein the cap and the pad are the same metallic material, have the same thickness where closest to one another and have different thickness where the cap is adjacent to the thermal post and the adhesive is essentially coplanar with the base and the terminal below the posts at a surface that faces in the downward direction.