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Integrated circuit package in package system with adhesiveless package attach

  • US 8,203,214 B2
  • Filed: 06/27/2007
  • Issued: 06/19/2012
  • Est. Priority Date: 06/27/2007
  • Status: Active Grant
First Claim
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1. A method for manufacturing an integrated circuit package in package system comprising:

  • providing a package in package lead with a package in package lead surface substantially planar;

    attaching a first integrated circuit package having a first package lead and a first encapsulant having a first encapsulant surface substantially coplanar with the package in package lead surface, the first package lead protruding from the first encapsulant;

    attaching a second integrated circuit near the first integrated circuit package; and

    forming a package in package encapsulant over the first integrated circuit package and the second integrated circuit, a side of the package in package lead opposite the package in package lead surface exposed from the package in package encapsulant.

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