Integrated circuit package including miniature antenna
First Claim
1. An integrated circuit package comprising:
- a package housing having a major surface;
a semiconductor die disposed in a first area of the package housing; and
an antenna disposed in a second area of the package housing separate from the first area and coupled to the semiconductor die, the antenna comprising a plurality of conducting segments that form a curve, the segments connected to each other at their ends forming angles different than 180 degrees,wherein at least two connections have angles less than 115 degrees, andwherein the curve comprises a first pair of segments forming a turn in a clockwise direction and a second pair of segments forming a turn in a counter-clockwise direction.
0 Assignments
0 Petitions
Accused Products
Abstract
The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor die. The conducting pattern comprises a curve having at least five sections or segments, at least three of the sections or segments being shorter than one-tenth of the longest free-space operating wavelength of the antenna, each of the five sections or segments forming a pair of angles with each adjacent segment or section, wherein the smaller angle of each of the four pairs of angles between sections or segments is less than 180° (i.e., no pair of sections or segments define a longer straight segment), wherein at least two of the angles are less than 115°, wherein at least two of the angles are not equal, and wherein the curve fits inside a rectangular area the longest edge of which is shorter than one-fifth of the longest free-space operating wavelength of the antenna.
-
Citations
40 Claims
-
1. An integrated circuit package comprising:
-
a package housing having a major surface; a semiconductor die disposed in a first area of the package housing; and an antenna disposed in a second area of the package housing separate from the first area and coupled to the semiconductor die, the antenna comprising a plurality of conducting segments that form a curve, the segments connected to each other at their ends forming angles different than 180 degrees, wherein at least two connections have angles less than 115 degrees, and wherein the curve comprises a first pair of segments forming a turn in a clockwise direction and a second pair of segments forming a turn in a counter-clockwise direction. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
-
16. An integrated circuit package comprising:
-
a substrate having first and second side opposed sides; and an antenna pattern formed on the first side of the substrate, the antenna pattern comprising a plurality of conducting segments that form a curve, the segments connected to each other at their ends where any two adjacent connected segments do not form a longer segment, wherein at least two connections have angles less than 115 degrees, and a first angle smaller than 115 degrees and a second angle smaller than 115 degrees are defined on opposite sides of the curve, and wherein the second side of the substrate has non-conducting material for at least 50% of an area below the antenna pattern. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
-
-
34. An integrated circuit package comprising:
-
a package housing having a plurality of package terminals provided on an exterior surface thereof; and an antenna fully enclosed in said package, the antenna comprising a plurality of conducting segments that form a curve, the segments connected to each other at their ends, wherein each connection forms two different angles, wherein at least two connections have angles less than 115 degrees; and a semiconductor chip provided within the package housing, the chip having a first terminal electrically coupled to the antenna and a second terminal coupled to the package terminals via wirebond connections. - View Dependent Claims (35, 36, 37, 38, 39)
-
-
40. An integrated circuit package comprising:
-
a package housing having a plurality of package terminals provided on an exterior surface thereof; and an antenna fully enclosed in said package, the antenna comprising a plurality of conducting segments that form a curve, the segments connected to each other at their ends, wherein each connection forms two different angles, wherein all connections form 90 degree angles; and a semiconductor chip provided within the package housing, the chip having a first terminal electrically coupled to the antenna and a second terminal coupled to the package terminals via wirebond connections.
-
Specification