Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
First Claim
1. A computer-implemented method for detecting defects on a wafer, comprising:
- combining multiple images of a structure formed on the wafer to generate a composite image of the structure, wherein the multiple images are acquired at multiple positions on the wafer at which the structure is formed, wherein the multiple images comprise gray levels, wherein said combining comprises determining a mean value and a median value of the gray levels across within die positions, and wherein the composite image comprises the mean value across the within die positions;
generating an additional composite image of the median value across the within die positions; and
comparing the composite image to a reference to detect defects on the wafer.
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Abstract
Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection includes acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer. The method also includes combining the output for the centrally located die and the one or more dies based on within die positions of the output. In addition, the method includes generating the standard reference die based on results of the combining step.
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Citations
16 Claims
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1. A computer-implemented method for detecting defects on a wafer, comprising:
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combining multiple images of a structure formed on the wafer to generate a composite image of the structure, wherein the multiple images are acquired at multiple positions on the wafer at which the structure is formed, wherein the multiple images comprise gray levels, wherein said combining comprises determining a mean value and a median value of the gray levels across within die positions, and wherein the composite image comprises the mean value across the within die positions; generating an additional composite image of the median value across the within die positions; and comparing the composite image to a reference to detect defects on the wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A system configured to detect defects on a wafer, comprising:
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an inspection system configured to acquire multiple images of a structure formed on the wafer; and a computer system configured for; combining the multiple images to generate a composite image of the structure, wherein the multiple images are acquired at multiple positions on the wafer at which the structure is formed, wherein the multiple images comprise gray levels, wherein said combining comprises determining a mean value and a median value of the gray levels across within die positions, and wherein the composite image comprises the mean value across the within die positions; generating an additional composite image of the median value across the within die positions; and comparing e composite image to a reference to detect defects on the wafer.
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16. A non-transitory computer-readable medium comprising program instructions executable on a computer system for performing a computer-implemented method for detecting defects on a wafer, wherein the computer-implemented method comprises:
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combining multiple images of a structure formed on the wafer to generate a composite image of the structure, wherein the multiple images are acquired at multiple positions on the wafer at which the structure is formed, wherein the multiple images comprise gray levels, wherein said combining comprises determining a mean value and a median value of the gray levels across within die positions, and wherein the composite image comprises the mean value across the within die positions; generating an additional composite image of the median value across the within die positions; and comparing the composite image to a reference to detect defects on the wafer.
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Specification