Methods and arrangements for managing plasma confinement

• US 8,206,604 B2
• Filed: 07/19/2010
• Issued: 06/26/2012
• Est. Priority Date: 12/29/2006
• Status: Active Grant

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Dine, Sebastien
• Primary Examiner(s): OLSEN, ALLAN W
• Application Number:
  US12/839,374
• Publication Number:
  US 20100279028A1
• Time in Patent Office: 708 Days
• Field of Search: None
• US Class Current: 216/67
• CPC Class Codes: C23C 16/509 using internal electrodes
• CPC Class Codes: H01J 37/32091 the radio frequency energy being capacitively coupled to the plasma
• CPC Class Codes: H01J 37/32559 Protection means, e.g. coatings
• CPC Class Codes: H01J 37/32587 Triode systems
• CPC Class Codes: H01J 37/32633 Baffles

Abstract

A method for confining plasma within a plasma processing chamber while processing a substrate is provided. The method includes igniting the plasma within a plasma generating area, wherein the plasma generating area is surrounded by a set of confinement rings. The method also includes providing a chamber wall outside of the set of confinement rings. The method further includes providing a dielectric liner electrode arrangement positioned between the chamber wall and the set of confinement rings, wherein the dielectric liner electrode arrangement having an electrode encapsulated within a dielectric liner, the dielectric liner electrode arrangement being coupled with the chamber wall to create a modified chamber wall. The method yet also includes providing a parallel LC circuit arrangement, the parallel LC circuit arrangement being coupled between the dielectric liner electrode arrangement and the chamber wall.

Claims

1. A method for confining plasma within a plasma processing chamber while processing a substrate, comprising:

igniting said plasma within a plasma generating area, wherein said plasma generating area is surrounded by a set of confinement rings;

providing a chamber wall outside of said set of confinement rings;

providing a dielectric liner electrode arrangement positioned between said chamber wall and said set of confinement rings, wherein said dielectric liner electrode arrangement having an electrode encapsulated within a dielectric liner, said dielectric liner electrode arrangement being coupled with said chamber wall to create a modified chamber wall; and

providing a parallel LC circuit arrangement, said parallel LC circuit arrangement being coupled between said dielectric liner electrode arrangement and said chamber wall.

2. The method of claim 1 wherein said electrode is cylindrical.

3. The method of claim 1 wherein said dielectric liner electrode arrangement is coupled to said chamber wall via a set of dielectric fixtures.

4. The method of claim 1 wherein said electrode is made from a conductive material.

5. The method of claim 1 wherein said dielectric liner has a larger width than said electrode.

6. The method of claim 1 wherein said parallel LC circuit arrangement includes an inductive circuit in parallel with a capacitor.

7. The method of claim 6 wherein said inductive circuit is a set of inductor coils.

8. The method of claim 6 wherein said inductive circuit is connected in series with a resistor.

9. The method of claim 6 wherein said inductive circuit is connected to said electrode via an electrical connection.

10. The method of claim 9 wherein said inductive circuit is adjustable by adjusting at least one of the size of the coils, the number of coil turns, the material of said coils, and the geometry of said coils.

11. An arrangement for confining plasma in a plasma processing chamber, comprising:

a set of confinement rings, wherein said plasma is formed within an area surrounded by said set of confinement rings;

a chamber wall outside of said set of confinement rings;

a dielectric liner electrode arrangement positioned between said chamber wall and said set of confinement rings, wherein said dielectric liner electrode arrangement having an electrode encapsulated within a dielectric liner, said dielectric liner electrode arrangement being coupled with said chamber wall to create a modified chamber wall; and

a parallel LC circuit arrangement, said parallel LC circuit arrangement being coupled between said dielectric liner electrode arrangement and said chamber wall; and

a lower electrode coupled to an RF power source configured to generate said plasma.

12. The arrangement of claim 11 wherein said electrode is cylindrical.

13. The arrangement of claim 11 wherein said dielectric liner electrode arrangement is coupled to said chamber wall via a set of dielectric fixtures.

14. The arrangement of claim 11 wherein said electrode is made from a conductive material.

15. The arrangement of claim 11 wherein said dielectric liner has a larger width than said electrode.

16. The arrangement of claim 11 wherein said parallel LC circuit arrangement includes an inductive circuit in parallel with a capacitor.

17. The arrangement of claim 16 wherein said inductive circuit is a set of inductor coils.

18. The arrangement of claim 16 wherein said inductive circuit is connected in series with a resistor.

19. The arrangement of claim 16 wherein said inductive circuit is connected to said electrode via an electrical connection.

20. The arrangement of claim 19 wherein said inductive circuit is adjustable by adjusting at least one of the size of the coils, the number of coil turns, the material of said coils, and the geometry of said coils.