Methods and arrangements for managing plasma confinement
First Claim
1. A method for confining plasma within a plasma processing chamber while processing a substrate, comprising:
- igniting said plasma within a plasma generating area, wherein said plasma generating area is surrounded by a set of confinement rings;
providing a chamber wall outside of said set of confinement rings;
providing a dielectric liner electrode arrangement positioned between said chamber wall and said set of confinement rings, wherein said dielectric liner electrode arrangement having an electrode encapsulated within a dielectric liner, said dielectric liner electrode arrangement being coupled with said chamber wall to create a modified chamber wall; and
providing a parallel LC circuit arrangement, said parallel LC circuit arrangement being coupled between said dielectric liner electrode arrangement and said chamber wall.
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Accused Products
Abstract
A method for confining plasma within a plasma processing chamber while processing a substrate is provided. The method includes igniting the plasma within a plasma generating area, wherein the plasma generating area is surrounded by a set of confinement rings. The method also includes providing a chamber wall outside of the set of confinement rings. The method further includes providing a dielectric liner electrode arrangement positioned between the chamber wall and the set of confinement rings, wherein the dielectric liner electrode arrangement having an electrode encapsulated within a dielectric liner, the dielectric liner electrode arrangement being coupled with the chamber wall to create a modified chamber wall. The method yet also includes providing a parallel LC circuit arrangement, the parallel LC circuit arrangement being coupled between the dielectric liner electrode arrangement and the chamber wall.
21 Citations
20 Claims
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1. A method for confining plasma within a plasma processing chamber while processing a substrate, comprising:
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igniting said plasma within a plasma generating area, wherein said plasma generating area is surrounded by a set of confinement rings; providing a chamber wall outside of said set of confinement rings; providing a dielectric liner electrode arrangement positioned between said chamber wall and said set of confinement rings, wherein said dielectric liner electrode arrangement having an electrode encapsulated within a dielectric liner, said dielectric liner electrode arrangement being coupled with said chamber wall to create a modified chamber wall; and providing a parallel LC circuit arrangement, said parallel LC circuit arrangement being coupled between said dielectric liner electrode arrangement and said chamber wall. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An arrangement for confining plasma in a plasma processing chamber, comprising:
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a set of confinement rings, wherein said plasma is formed within an area surrounded by said set of confinement rings; a chamber wall outside of said set of confinement rings; a dielectric liner electrode arrangement positioned between said chamber wall and said set of confinement rings, wherein said dielectric liner electrode arrangement having an electrode encapsulated within a dielectric liner, said dielectric liner electrode arrangement being coupled with said chamber wall to create a modified chamber wall; and a parallel LC circuit arrangement, said parallel LC circuit arrangement being coupled between said dielectric liner electrode arrangement and said chamber wall; and a lower electrode coupled to an RF power source configured to generate said plasma. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification