Voltage switchable dielectric material having bonded particle constituents

• US 8,206,614 B2
• Filed: 01/20/2009
• Issued: 06/26/2012
• Est. Priority Date: 01/18/2008
• Status: Expired due to Fees

• Current Assignee: Littelfuse Incorporated
• Original Assignee: Shocking Technologies, Inc.
• Inventors: Kosowsky, Lex, Fleming, Robert
• Primary Examiner(s): Nguyen, Khanh Tuan
• Application Number:
  US12/356,490
• Publication Number:
  US 20090212266A1
• Time in Patent Office: 1,253 Days
• Field of Search: 252/510, 252/511, 219/505, 361/18, 361/56, 361/118, 361/127, 388/21, 429/232, 428/403
• US Class Current: 252/511
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: H01B 1/24 the conductive material comprising carbon-silicon compounds, carbon or silicon
• CPC Class Codes: H01B 3/006 Other inhomogeneous material
• CPC Class Codes: H05K 1/0254 High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection electrostatic discharge protection for electric apparatus in general H05K9/0067, H05K9/0079; Arrangements for regulating voltages or for using plural voltages
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0224 Conductive particles having an insulating coating
• CPC Class Codes: H05K 2201/0257 Nanoparticles inks comprising nanoparticles H05K1/097
• CPC Class Codes: H05K 2201/026 Nanotubes or nanowires
• CPC Class Codes: H05K 2201/0738 Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
• CPC Class Codes: Y10T 428/2991 Coated

Abstract

A voltage switchable dielectric material comprising a concentration of multi-component particles that are individually formed by a mechanical or mechanochemical bonding process that bonds a semiconductive or conductive-type host particle with multiple insulative, conductive, or semi-conductive guest particles.

Claims

1. A composition comprising:

a binder;

particles dispersed uniformly within the binder, wherein at least some of the particles are multi-component particles that singularly comprise;

a conductive host particle that is micron sized, and multiple insulative or semi-conductive guest particles that are nano or sub-micron sized;

wherein at least some of the particles comprise the conductive host particle being bonded with the multiple insulative or semi-conductive guest particles through mechanical or mechano-chemical bonding; and

wherein said composition is (i) dielectric in absence of any voltage that exceeds a characteristic voltage level, and (ii) conductive with application of a voltage that exceeds the characteristic voltage level.

2. The composition of claim 1, wherein the particles are dispersed into the binder beyond a percolation threshold.

3. The composition of claim 2, wherein the percolation threshold coincides with a conductor or semiconductor particle concentration in range of 20-80% by volume.

4. The composition of claim 1, wherein the guest particles include organic material.

5. The composition of claim 4, wherein the organic material corresponds to carbon nanotubes, perylene, or graphene.

6. The composition of claim 1, wherein the multiple insulative or semi-conductive guest particles includes titanium dioxide or fumed silica.

7. The composition of claim 1, wherein at least some of the particles are (i) selected from a group consisting of graphenes, carbon nanotubes, nanowires, nanorods, antimony in oxide (ATO) nanorods, and (ii) uniformly dispersed in the binder.

8. The composition of claim 1, wherein the particles are dispersed into the binder beyond a percolation threshold, and wherein the characteristic voltage is dependent in part on a resistive characteristic of the multiple insulative or semi-conductive guest particles of the multi-component particles.

9. A composition comprising:

a binder;

particles dispersed uniformly within the binder, wherein at least some of the particles are multi-component particles that singularly comprise;

a conductive host particle, and multiple insulative or semi-conductive guest particles that include organic material;

wherein at least some of the particles comprise the conductive host particle being bonded with the multiple insulative or semi-conductive guest particles through mechanical or mechano-chemical bonding; and

wherein said composition is (i) dielectric in absence of any voltage that exceeds a characteristic voltage level, and (ii) conductive with application of a voltage that exceeds the characteristic voltage level.

10. The composition of claim 9, wherein the particles are dispersed into the binder beyond a percolation threshold.

11. The composition of claim 10, wherein the percolation threshold coincides with a conductor or semiconductor particle concentration in range of 20-80% by volume.

12. The composition of claim 9, wherein, for the at least some of the multi-component particles, the conductive host particle are micron sized, and multiple insulative or semi-conductive guest particles are nano or sub-micron sized.

13. The composition of claim 9, wherein the organic material corresponds to carbon nanotubes, perylene, or graphene.

14. The composition of claim 9, wherein the multiple insulative or semi-conductive guest particles includes titanium dioxide or fumed silica.

15. The composition of claim 9, wherein at least some of the particles are (i) selected from a group consisting of graphenes, carbon nanotubes, nanowires, nanorods, antimony in oxide (ATO) nanorods, and (ii) uniformly dispersed in the binder.

16. The composition of claim 9, wherein the particles are dispersed into the binder beyond a percolation threshold, and wherein the characteristic voltage is dependent in part on a resistive characteristic of the multiple insulative or semi-conductive guest particles of the multi-component particles.